ABLESTIK 64C
Harmonization Code : 3403.19 | Lubricating Preparations (With 70% or More Petroleum Oils) For Automotive and Other Uses
Main features
- Non-Silver Conductive Bonding
- Room-Temperature or Heat Cure
- Seawater-Exposure Assembly Fit
Product Description
LOCTITE ABLESTIK 64C is a two-component, non-silver, electrically conductive epoxy adhesive for assembly bonding. Component A is a dark gray paste and Component B is a clear liquid mixed at 100:5 by weight. The mixed adhesive provides a 40-minute work life at 25 deg C for a 100 g mass and cures for 24 hours at 25 deg C or 1 hour at 70 deg C. Its non-silver conductive formulation is recommended where seawater exposure can corrode silver-based conductive adhesives. The cured material has a typical volume resistivity of 0.02 ohm cm at 25 deg C.
Key features
- Non-silver conductive formulation: Provides electrically conductive bonding without silver filler for seawater-exposure applications.
- Room-temperature or heat cure: Cures in 24 hours at 25 deg C or 1 hour at 70 deg C to match the available process.
- Defined mixed work window: A 40-minute work life at 25 deg C for a 100 g mass supports controlled mixing and assembly.
Applications
Applications include electrically conductive assembly bonding where seawater exposure can corrode silver-based conductive adhesives.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
The 100:5 mix ratio is by weight; component-specific values are listed separately for Part A and Part B.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Component A appearance | Dark gray paste | Resin | |
| Component B appearance | Clear liquid | Hardener | |
| Mix ratio, A:B | 100:5 | by weight | Specified component ratio |
| Component A density | 3.2 | g/cm^3 | Typical |
| Component B density | 1.0 | g/cm^3 | Typical |
| Work life | 40 | minutes | Mixed material; 100 g mass at 25 deg C |
| Cure schedule | 24 at 25 or 1 at 70 | hours at deg C | Guideline room-temperature or heat cure |
| Component shelf life | 180 | days | 25 deg C; Part A and Part B |
After-processing / final-state properties
Final-state values are typical for the cured two-component adhesive under the stated conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating temperature | -55 to 130 | deg C | Product operating range |
| Coefficient of thermal expansion | 45 | ppm/deg C | TMA |
| Thermal conductivity | 1.44 | W/(m K) | Typical cured material |
| Volume resistivity | 0.02 | ohm cm | 25 deg C |
| Tensile lap shear strength | 5.5 | N/mm^2 | Typical cured material |
