LOCTITE ABLESTIK 84-1LMIT1

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE ABLESTIK 84-1LMIT1

Main features

  • Electrically conductive
  • High thermal conductivity
  • Faster Screen printing

Product Description

LOCTITE ABLESTIK 84-1LMIT1 epoxy adhesive is designed for medium sized die attach applications. It is designed for screen printing using 325 mesh. This T1 version has lower viscosity, for finer and faster screen printing compared to 84-1LMIT.

LOCTITE ABLESTIK 84-1LMIT1 meets the military requirements of MIL-STD883C, Method 5011 and also passes NASA outgassing requirements. It is an electrically and thermally conductive, solvent free adhesive with low viscosity and good adhesion.

Cure Schedule

  • 1 hour @ 150°C 
  • 2 hours @ 125°C
Product Family

ABLESTIK 84-1LMIT1

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TDS, SDS & Technical Documents

Technical Specifications

Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
103 °C
Thermal ConductivityThermal Conductivity
3.6 W/m.K
Weight Loss @ 300°CWeight Loss @ 300°C
0.16 %
Electrical Properties
Volume ResistivityVolume Resistivity
0.0005 Ohms⋅cm
Physical Properties
ViscosityViscosity
22,000 mPa.s

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