ABLESTIK 931-1

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

ABLESTIK 931-1

Main features

  • Low-Viscosity Fine-Gap Encapsulation
  • Low-Exotherm One-Step Casting Cure
  • 27.6 kV/mm Dielectric Strength

Product Description

LOCTITE® ECCOBOND 931-1 is a one-component, heat-cured epoxy encapsulant designed for general potting applications. Its low viscosity and wetting characteristics support impregnation of tightly wound coils and flow around closely packed components. The clear-amber material provides a typical viscosity of 300 cP at 25°C and a six-hour work life at 25°C. Its low-exotherm formulation supports one-step curing of large castings under suitable process conditions, with guideline cure options including 1 hour at 100°C or short heat exposure followed by 24 hours at 25°C.

Key features

  • Low-viscosity impregnation: Typical viscosity of 300 cP at 25°C supports flow into tightly wound coils and intricate assemblies.
  • Low-exotherm curing: Formulated to support one-step curing of large castings under appropriately validated process conditions.
  • Electrical insulation: Typical cured properties include dielectric strength of 27.6 kV/mm and volume resistivity of 2 × 1014 ohm-cm.

Applications / Suitable for

  • General potting applications
  • Impregnation of tightly wound coils
  • Encapsulation of closely packed components
  • Large castings requiring controlled low-exotherm processing
Product Family

ABLESTIK 931-1

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Clear amber
Chemistry TypeChemistry Type
Epoxy
Work life @25°CWork life @25°C
6 hours
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
100 °C
Thermal ConductivityThermal Conductivity
0.2 W/m.K
Electrical Properties
Dielectric StrengthDielectric Strength
27.6 kV/mm
Volume ResistivityVolume Resistivity
2×10¹⁴ Ohms⋅cm
Physical Properties
ViscosityViscosity
300 mPa.s

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties, storage conditions, work life, and guideline cure schedules for the encapsulant before final processing.

Property Value Unit Method / condition
Technology Epoxy One-component encapsulant
Appearance Clear amber liquid As supplied
Viscosity 300 cP At 25°C; test method not stated
Density 1.1 g/cm³ As supplied
Work life 6 hours At 25°C
Shelf life 365 days At -40°C, from date of manufacture
Shelf life 182 days At 5°C, from date of manufacture
Cure schedule 1 hour, 5 minutes plus 24 hours, or 3 minutes plus 24 hours 1 hour at 100°C; 5 minutes at 100°C plus 24 hours at 25°C; or 3 minutes at 130°C plus 24 hours at 25°C; guideline recommendations
Technical properties

After-processing / final-state properties

Typical physical, thermal, ionic, and electrical properties of the cured encapsulant. Values are reference data and are not product specifications.

Property Value Unit Method / condition
Hardness 88 Shore D Cure condition and test method not stated
Density — cured 1.2 g/cm³ Test method and cure condition not stated
Glass-transition temperature 100 °C Method and cure condition not stated
Coefficient of thermal expansion — below Tg 67 ppm/°C TMA; cure condition not stated
Coefficient of thermal expansion — above Tg 240 ppm/°C TMA; cure condition not stated
Weight loss at 150°C 0.08 % Test method and exposure duration not stated
Weight loss at 250°C 0.3 % Test method and exposure duration not stated
Weight loss at 300°C 1.0 % Test method and exposure duration not stated
Water-extract conductivity 51 µmhos/cm Extraction conditions and test method not stated
Extractable chloride 100 ppm Test method and extraction conditions not stated
Extractable sodium 5 ppm Test method and extraction conditions not stated
Extractable potassium 5 ppm Test method and extraction conditions not stated
Thermal conductivity at 121°C 0.2 W/(m·K) Test method and specimen configuration not stated
Dielectric strength 27.6 (700) kV/mm (V/mil) Test method, thickness, and conditioning not stated
Dielectric constant 4.5 Frequency and test method not stated
Dissipation factor 0.026 Frequency and test method not stated
Volume resistivity 2 × 1014 ohm-cm Test method and cure condition not stated

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