LOCTITE ABLESTIK A329-1

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LOCTITE ABLESTIK A329-1

Main features

  • Class F (155°C)
  • Insulating applications
  • Resistance to water, freon, solvents etc

Product Description

LOCTITE ABLESTIK A329-1 epoxy encapsulant is designed for insulating applications. It is made thixotropic to prevent sag during heat cure. LOCTITE ABLESTIK A329-1 bonds offer resistance to water, freon, solvents, acids and strong bases.

LOCTITE ABLESTIK A329-1 is a non conductive thixotropic epoxy with oxide filler that is typically used for bonding/insulating metals and for bonding FRP and molded phenolic parts. It is a high temperature performance class F (155°C) sag resistant material with good thermal stability.

Cure Schedule

  • 1 minute @180°C
  • 3 minutes @160°C
  • 20 minutes @120°C
  • 90 minutes @100°C
Product Family

ABLESTIK A329-1

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Product availability
US Shipping in 12 weeks
CA Shipping in 12 weeks
EU Shipping in 25 days
TDS, SDS & Technical Documents

Technical Specifications

Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
130 °C
Thermal ConductivityThermal Conductivity
0.4 W/m.K
Electrical Properties
Volume ResistivityVolume Resistivity
100000000000000 Ohms⋅cm
Physical Properties
ViscosityViscosity
27,500 mPa.s

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