LOCTITE ABLESTIK ABP 6389
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- High-reliability QFP manufacture
- Low outgassing
- Good adhesion to BSM & Non BSM die
Product Description
LOCTITE®ABLESTIK ABP 6389 electrically conductive die attach adhesive is designed for high reliability package applications. It is formulated with good thermal conductivity for heat management, along with excellent electrical conductivity to achieve low ON Resistance (RDS(ON)) in MOSFET devices.
LOCTITE®ABLESTIK ABP 6389 is engineered to bond with or without BSM (BacksideMetallization) die. Its moderate modulus, good adhesion and low stress enable robust bonding of small to large die on a wide variety of metal surfaces, including bare Copper, Ag and PPF leadframes. This low outgassing epoxy is typically used for SOIC, SOP, QFP and QFN package applications
Cure Schedule
- 30 minutes ramp to 175°C+60 minutes @175°C, in N2 or air
ABLESTIK ABP6389
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Technical Specifications
Thermal Properties
Physical Properties
Additional Information
Specific Characteristics:
- Good workability
- High reliability
- Good electrical and thermal conductivity
- Good adhesion to Cu, Ag and PPF
- Good adhesion to Non-BSM and BSM die
- Low stress
- Low outgassing
