LOCTITE ABLESTIK ABP 8068TD
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Good workability
- ±50 W/mK Thermal Conductivity
- High electrical conductivity
Product Description
LOCTITE ABLESTIK ABP 8068TD is a semi-sintering die-attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. It is engineered to bond to a variety of die with or without BSM (Back side Metallization).
LOCTITE ABLESTIK ABP 8068TD epoxy-assisted sintering formulation is designed to provide high adhesion, high thermal, and low-stress properties which are essential for the thermal and reliability performances of high-end power packages such as SiP.
Technical Specifications
No specifications available.
Additional Information
What are the MSL and Thermal cycling expectations?
ABP 8068TD has successfully passed MSL3 + 1000 TC (-65/+150C) on PPF QFN device with 3x3mm Ag BSM. As such, we do believe that ABP 8068TD may also pass -40/+125C temp cycling on a larger 4x5mm die size.
For such a larger die size, we do recommend a longer 1hr staging time @ 130°C + minimum 1hr sintering @ 200°C
Cure Schedule
Cure Schedule for Ag, Au and PPF leadframe:
20 minutes ramp to 130°C, hold for 30 minutes, 15 minutes ramp to 200°C, hold for 1 hour in Air or N2
Cure Schedule for Cu leadframe:
20 minutes ramp to 130°C, hold for 30 minutes, 15 minutes ramp to 200°C, hold for 1 hour in N2
Alternate Cure Schedule
Cure Schedule for Ag, Au and PPF leadframe:
20 minutes ramp to 130°C, hold for 30 minutes, 20 minutes ramp to 220°C, hold for 1 hour in Air or N2
Cure Schedule for Cu leadframe:
20 minutes ramp to 130°C, hold for 30 minutes, 20 minutes ramp to 220°C, hold for 1 hour in N2
