LOCTITE ABLESTIK CDF 815P
Harmonization Code : 7115.90.00.00 | Other articles of precious metal or of metal clad with precious metal : Other
Main features
- Electrically conductive
- Thermally conductive
- QFN, SOIC, SO
Product Description
LOCTITE ABLESTIK CDF 815P highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 4mm x 4mm.
LOCTITE ABLESTIK CDF 815P exhibits high MSL reliability and excellent in package thermal and electrical resistance. It is typically used for die attach in QFN, SOIC and SO packages.
Cure Schedule
- 30 minute ramp from 25°C to 200°C, hold 60 minutes at 200°C
- 30 minute ramp from 25°C to 175°C, hold 60 minutes at 175°C
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Film ThicknessFilm Thickness
15 µmWork life @25°CWork life @25°C
2160 hoursThermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
12 °CThermal ConductivityThermal Conductivity
3.4 W/m.KElectrical Properties
Volume ResistivityVolume Resistivity
0.0002 Ohms⋅cmAdditional Information
CDF 800P - Die attach film property comparison
