ABLESTIK ECF 568
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Electrically Conductive Application
- 2-Hour 95 deg C Cure
- Sheet Stock or Die-Cut Preforms
Product Description
LOCTITE® ABLESTIK ECF 568 is a high-purity, electrically conductive epoxy film adhesive designed for substrate-attach applications. The silver film uses a glass-fabric carrier with a nominal carrier thickness of 1 mil and is supplied as sheet stock or customer-specific die-cut preforms. It provides a typical 24-hour work life at 25°C and heat-cure options of 2 hours at 95°C or 4 hours at 75°C. Cured performance includes electrical resistance of 0.002 ohm per 0.5 in² measured through gold joints and lap shear strength of 3,500 psi for gold-to-gold bonds at 25°C.
Key features
- Electrically conductive film: Typical electrical resistance is 0.002 ohm per 0.5 in² when measured through cured gold joints.
- Low-temperature heat cure: Guideline cure schedules include 2 hours at 95°C or 4 hours at 75°C.
- Preformed adhesive format: Available as sheet stock or die-cut preforms for substrate-attach assembly.
Applications / Suitable for
- Substrate-attach applications
- Electrically conductive bonding through gold joints
- Assembly processes using sheet stock or die-cut adhesive preforms
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical construction, handling, storage, and cure information for the adhesive film before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy film | — | As supplied |
| Appearance | Silver film | — | Solid film |
| Carrier type | Glass fabric | — | Adhesive-film construction |
| Carrier thickness | 1 | mil | Nominal carrier thickness |
| Work life | 24 | hours | At 25°C |
| Shelf life | 365 | days | At -40°C, from date of manufacture |
| Cure schedule | 2 hours or 4 hours | — | 2 hours at 95°C or 4 hours at 75°C; maintain 2–10 psi pressure during cure |
After-processing / final-state properties
Typical cured-film properties and bonded-joint performance. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Coefficient of thermal expansion — below Tg | 65 | ppm/°C | TMA; cure condition not stated |
| Coefficient of thermal expansion — above Tg | 400 | ppm/°C | TMA; cure condition not stated |
| Glass-transition temperature | 113 | °C | TMA; cure condition not stated |
| Electrical resistance through gold joints | 0.002 | ohm/0.5 in² | Measured through gold joints |
| Lap shear strength — aluminum to aluminum | 5,100 | psi | Tested at 25°C; aluminum surface condition and cure condition not stated |
| Lap shear strength — gold to gold | 3,500 | psi | Tested at 25°C; surface preparation and cure condition not stated |
