LOCTITE ABLESTIK ICP 2120
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- CCM bracket grounding
- 50°C Cure temp
- High thermal conductivity
Product Description
LOCTITE ABLESTIK ICP 2120 silver filled silicone MS polymer is developed for conductive bonding in high-volume consumer devices (curing at 50° Celsius and lower by moisture) . It shows excellent adhesion in interfaces such as SUS and Nickel.
LOCTITE ABLESTIK ICP 2120 displays excellent DCR and VR performance. It has a very high thermal conductivity (7 W/mK) and low tensile modulus. This silicon adhesive is used for low temp/moisture curable application for CCM bracket grounding.
LOCTITE ABLESTIK ICP 2120 is a low modulus ECA which will cure at temperatures between 25°C and 50°C by moisture and or heat. As such it can be a good option for battery applications requiring a maximum of 60°C curing temperature.
Cure Schedule
- 30min @ 50°C
ABLESTIK ICP2120
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Thermal Properties
Physical Properties
Additional Information
- Enables high yield and mass production of production of thin, delicate, heat-sensitive devices
- Facilitates robust CCM operation with excellent electrical grounding performance and protection against ESD
- High reliability electrical and thermal performance
- Highly stable for production adaptability
