ABLESTIK KS 0004
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Main features
- 0.01 ohm-cm Volume Resistivity
- 2-Hour 60 deg C Cure
- Conductive Bonding and Encapsulation Utility
Product Description
LOCTITE ABLESTIK KS 0004 KIT is a silver, two-component, 100% solids epoxy putty for conductive encapsulation, potting, and bonding. The resin and hardener are mixed at 100:8 by weight, providing a typical 35-minute pot life at 25°C. The material can be heat cured for 2 hours at 60°C or cured at room temperature, and a minimum 60°C cure is required to develop maximum electrical conductivity. Documented uses include forming electrical bonds where soldering heat is impractical, bonding RF shields, and preparing conductive surfaces.
Key Features
- Silver, two-component epoxy putty with 100% solids content
- 100:8 resin-to-hardener mix ratio by weight
- Typical 35-minute pot life at 25°C for a 20 g mixed mass
- Heat-cure and room-temperature cure options
- Typical cured volume resistivity of 0.01 ohm·cm at 25°C
- Typical aluminum-to-aluminum tensile shear strength up to 13.1 N/mm² after a 2-hour cure at 60°C
Applications / Suitable for
- Conductive encapsulation and potting
- Electrical bonds where soldering heat is impractical
- RF shield bonding
- Conductive surface preparation
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Electrical Properties
Additional Information
LOCTITE ABLESTIK KS 0004 KIT
LOCTITE ABLESTIK KS 0004 KIT is a silver, two-component, 100% solids epoxy putty formulated for conductive encapsulation, potting, and bonding tasks. The mixed system combines a 35-minute pot life at 25 deg C with room-temperature or heat-cure options and develops a low typical volume resistivity after cure.
As-supplied properties
Component-specific and mixed-material values are kept separate to support accurate handling and process planning.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Part A - LOCTITE ABLESTIK KE 4238 filler content | 73 | % | As supplied |
| Part A - LOCTITE ABLESTIK KE 4238 specific gravity | 3.025 | - | 25 deg C |
| Part A - LOCTITE ABLESTIK KE 4238 viscosity / form | Paste | - | Brookfield RVF, spindle 5, 4 rpm, 25 deg C |
| Part B - LOCTITE STYCAST HD 3475 specific gravity | 1.1 | - | 25 deg C |
| Part B - LOCTITE STYCAST HD 3475 viscosity | 7,000 | mPa s (cP) | Brookfield RVF, spindle 5, 4 rpm, 25 deg C |
| Mixed material density | 0.105 | lb/in^3 | As mixed |
| Mixed material pot life | 35 | minutes | 25 deg C, 20 g mass |
Processing and cure
Thoroughly mix Part A in its original container before measuring. Combine resin and hardener at 100:8 by weight, then apply the mixed material within its typical 35-minute pot life at 25 deg C. Cure conditions are guideline recommendations and should be validated for the assembly, material mass, and actual equipment temperature.
Store the unopened product in a dry location. The stated optimal storage range is 8 to 28 deg C, and each component has a typical shelf life of 365 days at 25 deg C from the date of shipment. Do not return material removed from a container to the original container. Consult the applicable safety information before handling either component.
Cured properties
Typical cured-property data are shown with their reported test context and are not presented as guaranteed design specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Volume resistivity | 0.01 | ohm cm | 25 deg C; thin adhesive strip cured on glass. Minimum cure temperature of 60 deg C required for maximum conductivity. |
| Thermal conductivity | 145 | BTU in/(h ft^2 deg F) | Typical bulk cured-material value; also reported as 500 x 10^-4 cal cm/(s cm^2 deg C). |
| Tensile shear strength | 13.1 (1,900) | N/mm^2 (psi) | Aluminum-to-aluminum, cured 2 hours at 60 deg C. |
| Tensile shear strength | 9.65 (1,400) | N/mm^2 (psi) | Aluminum-to-aluminum, cured 36 hours at 25 deg C. |
| Flammability | Pass | - | Test method not identified in the supplied data. |
| IEEE operating class guide | 105 | deg C | Reported guide to operating class; not presented as a universal service-temperature limit. |
Applications
Documented use contexts include electrical connections, RF shield bonding, and conductive surface preparation.
Evaluate LOCTITE ABLESTIK KS 0004 KIT for your application
Krayden can help review mix, cure, conductive-performance, substrate, and application requirements for LOCTITE ABLESTIK KS 0004 KIT. Discuss the intended assembly and process conditions with our technical team before establishing production parameters or acceptance criteria.





















