LOCTITE ABLESTIK QMI536 HT
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Bismaleimide resin
- Hydrophobic
- Excellent interfacial adhesive strength
Product Description
LOCTITE® ABLESTIK QMI536 HT is a Boron nitride filled non-conductive adhesive for attachment of integrated circuits and components to advanced substrates and used in packages such as PBGAs, CSPs, array packages, and stacked die. Typical applications would include heatsinks, heatslugs and flip chips. This material is hydrophobic and stable at high temperatures.
LOCTITE® ABLESTIK QMI536 HT is a BMI/Acrylate hybrid that achieves a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic and metal surfaces, including solder mask, BT, FR, polyimide, Palladium and Au. This pink, skip curable adhesive, also has excellent dielectric properties and good resistance to popcorning after beig exposed to reflow temperatures.
Cure schedule
- 15 minutes @ 150°C at bondline (Conventional Oven )
- ≥10 seconds @ 150°C at bondline (Snap Cure)
- ≥10 seconds @ 150°C at bondline (Tunnel Oven configured with hot gas or IR)
- ≥8 seconds @ 150°C at bondline (SkipCure )
ABLESTIK QMI536 HT
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 35 daysTechnical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
Additional Information
DMA Modulus of QMI536HT at different temperatures
The DMA Modulus curve shows the modulus of QMI536HT over a temperature range from -100°C up to 300°C
