ABLESTIK SF 40
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- Low-Density Syntactic Foam Adhesive
- Thixotropic Vertical-Surface Control
- Room-Temperature Adhesive Cure
Product Description
LOCTITE® ABLESTIK SF 40 is a two-component, non-conductive epoxy adhesive formulated as a lightweight, low-density syntactic foam. The thixotropic, non-sag system is suitable for bonding and repairing vertical surfaces where limiting added weight is important. It mixes at 100:9 by weight and can be cured at room temperature or with heat. Documented applications include aerospace and hydrospace assemblies, with ceramics, metals, and plastics identified as key substrates. The cured adhesive has a documented operating-temperature range of -40 to 120°C.
Key features
- Lightweight syntactic foam: Mixed density of 0.64 g/cm³ supports bonding and repair applications where added weight is a consideration.
- Non-sag, thixotropic consistency: Supports application to vertical surfaces while helping the mixed adhesive remain in place before cure.
- Flexible cure options: Cures in 48 to 72 hours at 25°C or in 2 to 4 hours at 65°C.
Applications / Suitable for
- Aerospace applications
- Hydrospace applications
- Repairing vertical surfaces with limited added weight
- Bonding ceramics, metals, and plastics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical properties of the individual components and mixed adhesive before cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance — Part A | White paste | — | As supplied |
| Appearance — Part B | Amber liquid | — | As supplied |
| Mix ratio — Part A:Part B | 100:9 | by weight | Two-component system |
| Density — Part A | 0.61 | g/cm³ | ASTM D792 |
| Viscosity — Part B | 95 | mPa·s (cP) | Brookfield viscosity, ASTM D2393 |
| Density — Part B | 0.98 | g/cm³ | ASTM D792 |
| Density — mixed adhesive | 0.64 | g/cm³ | ASTM D792 |
| Work life | 30 | minutes | 100 g mixed quantity at 25°C |
| Shelf life | 365 | days | At 25°C |
| Cure schedule | 48–72 hours or 2–4 hours | — | 48–72 hours at 25°C or 2–4 hours at 65°C; guideline recommendations |
After-processing / final-state properties
Typical properties and performance data for the cured adhesive. Values are reference data rather than product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating-temperature range | -40 to 120 | °C | Documented product range |
| Hardness | 70 | Shore D | ASTM D2240 |
| Water absorption | 2.0 | % | ASTM D570 |
| Coefficient of thermal expansion — below Tg | 33 | ppm/°C | ASTM D3386 |
| Coefficient of thermal expansion — above Tg | 107 | ppm/°C | ASTM D3386 |
| Glass-transition temperature | 107 | °C | ASTM D3418 |
| Dielectric strength | 13.8 | kV/mm | ASTM D149 |
| Dielectric constant / dissipation factor | 2.5 / 0.02 | — | ASTM D150 at 1 mHz, as reported |
| Volume resistivity at 25°C | 1 × 1012 | ohm-cm | ASTM D257 |
| Total mass loss | 0.23 | % | TML, ASTM E595 |
| Collected volatile condensable material | 0.04 | % | CVCM, ASTM E595 |
| Tensile lap shear strength — aluminum to aluminum | 14.5 (2,100) | N/mm² (psi) | Tested at 25°C |
| Tensile lap shear strength — aluminum to aluminum | 12.4 (1,800) | N/mm² (psi) | Tested at 65°C |
