ALPHA 856

ALPHA 856 Liquid Soldering Flux is a neutral organic-acid, water-soluble liquid flux for wave soldering processes that use post-solder water cleaning. Its buffered activation system contains no free acid, and the post-solder residues are non-acidic. The low-smoking formulation is designed for foam application with a fine-bubble head that breaks quickly and recovers rapidly at production speed. During use, specific gravity at 25 deg C is maintained at 0.822 to 0.842 with ALPHA 425 thinner. Residues remain water soluble and should be thoroughly removed within four hours; hot DI-water rinsing at 50 to 60 deg C is specified for low ionic contamination before drying.

Key features

• Neutral buffered activation: Contains no free acid and produces non-acidic post-solder residues for controlled water-cleaned soldering processes.
• Fast-recovering foam coverage: A fine-bubble foam head breaks quickly and recovers rapidly to maintain coverage at production speed.
• Controlled water-cleaning window: Water-soluble residues should be removed within four hours, with a 50 to 60 deg C hot DI-water rinse used for low ionic contamination.

Applications

Used in water-cleaned wave soldering of electronic assemblies with foam flux application, controlled flux density, and prompt hot DI-water residue removal.