ALPHA SM42-1311

Harmonization Code : 3208.20.90 | Paints and varnishes that are dispersed or dissolved in a non aqueous medium

ALPHA SM42-1311

Main features

  • High-Speed Room-Temperature Dispensing
  • 80-Second Cure at 150 deg C
  • Non-Sagging Epoxy Paste

Product Description

ALPHA SM42-1311 SMD Adhesive is a one-component, fast-curing red epoxy paste for high-speed dispensing and surface-mount component attachment. Its non-sagging rheology and thixotropic index of at least 5.0 support controlled dot formation at room temperature. The adhesive develops full properties after a minimum 120 seconds at 120 deg C or 80 seconds at 150 deg C in a convection oven. Typical uncured data include 350 to 550 Poise viscosity at 25 deg C and 1.1 to 1.3 specific gravity. Documented cured properties include at least 90 deg C glass-transition temperature, less than 1.0% moisture absorption, and greater than 1 x 10^12 ohm insulation resistance under the stated test conditions.

Key features

  • High-speed dispensing: Designed for room-temperature dispensing in surface-mount assembly.
  • Short heat-cure options: Full property development at 120 deg C for 120 seconds or 150 deg C for 80 seconds minimum.
  • Non-sagging epoxy paste: A thixotropic index of at least 5.0 supports controlled placement.

Applications

Dispensed surface-mount component attachment in electronics assembly.

Product Family

ALPHA SM42-1311

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

Physical Properties
Thixotropic indexThixotropic index
≥ 5.0
ViscosityViscosity
35000–55000 Poise mPa.s
General Properties
Specific GravitySpecific Gravity
1.1–1.3
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
≥ 90 °C

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
ChemistryEpoxyUncured material
AppearanceRed pasteUncured material
Viscosity350 to 550PoiseMalcom PC-10A, 30 rpm, 25 deg C
Specific gravity1.1 to 1.3Typical uncured value
Thixotropic index>= 5.0Tentative specification
Pot life7days25 deg C
Shelf life6months1 to 10 deg C
Shelf life14days25 deg C
Technical properties

After-processing / final-state properties

Typical cured-material values; cure basis is at least 120 seconds at 120 deg C or 80 seconds at 150 deg C in a convection oven.

PropertyValueUnitMethod / condition
Glass-transition temperature>= 90deg CTMA
CTE alpha160 +/- 10ppmBelow Tg; TMA
CTE alpha2190 +/- 20ppmAbove Tg; TMA
CorrosionNone96 hours at 40 deg C and 95% RH
Moisture absorption< 1.0% by weight24 hours in water at 25 deg C
Insulation resistance> 1 x 10^12ohm96 hours at 85 deg C and 85% RH
Hardness80 to 90Shore DTypical cured value

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