ALPHA WS809
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Print Speeds From 1 to 6 Inches
- Eight-Hour Stencil Life
- Water-Cleanable After Two Reflows
Product Description
ALPHA WS-809 Solder Paste is a water-soluble tin-lead solder paste for a broad range of stencil-printed SMT processes using aqueous post-reflow cleaning. It supports fine-pitch printing, including 0.016 in pitch QFP patterns and 0.015 in circular apertures, at print speeds from 1 to 6 in/s. Available alloy options include 63Sn/37Pb, 62Sn/36Pb/2Ag, and NT4S, with 89.8% metal loading in Type 3 or Type 4 powder. Typical physical data include 4.4 g/cc paste density for 63Sn/37Pb, 1,550 to 2,550 poise viscosity at 10 rpm, and eight hours of stencil life at 24-27 deg C and 30-50% RH. Residues remain water-cleanable after two reflow cycles.
Key features
- Broad print-speed range: Supports stencil printing from 1 to 6 in/s under the documented process.
- Eight-hour stencil life: Maintains stencil performance at 24-27 deg C and 30-50% RH.
- Two-reflow cleanability: Flux residues remain water-cleanable after two paste reflow cycles.
Applications
Fine-pitch and general stencil-printed SMT assembly using tin-lead alloys and aqueous post-reflow cleaning.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Alloy options | 63Sn/37Pb; 62Sn/36Pb/2Ag; NT4S | Available configurations | |
| Metal loading | 89.8 | % | Typical configuration |
| Powder sizes | Type 3: 25-45 um; Type 4: 20-38 um | IPC J-STD-005 | |
| Flux activity | ORH0 | IPC J-STD-004A | |
| Paste density | 4.4 | g/cc | Typical; 63Sn/37Pb alloy |
| Viscosity | 1,550-2,550 | Poise | Malcom spiral viscometer, ICP-029, 10 rpm |
| Stencil life | 8 | hours | 24-27 deg C, 30-50% RH |
| Shelf life | 6 | months | Refrigerated at 0-10 deg C |
