CNP CVP390V
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- 170 um Fine-Feature Coalescence
- Over Eight-Hour Stencil Life
- Air or Nitrogen Reflow
Product Description
ALPHA CVP-390V Solder Paste is a lead-free, no-clean, zero-halogen solder paste for fine-feature and high-reliability surface-mount PCB assembly. It supports repeatable 01005 stencil printing and coalescence on apertures down to 170 um under the stated process conditions. The ROL0 flux system provides more than eight hours of stencil life at 25 deg C and 30% RH, with a print-speed guideline of 25 to 150 mm/s. Reflow can be performed in air or nitrogen. The paste is intended for supported lead-free alloy configurations used in fine-feature, high-density SMT processing.
Key features
- Fine-Feature Coalescence: supports coalescence on circle and square apertures down to 170 um under stated process conditions
- Extended Stencil Life: provides more than eight hours of consistent transfer at 25 deg C and 30% RH
- Flexible Reflow Atmosphere: supports reflow in air or nitrogen environments
Applications
Fine-feature and high-reliability surface-mount PCB assembly using supported lead-free alloy configurations.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Flux classification | ROL0 | IPC J-STD-004B | |
| Tack force | >=100 | gf | Minimum 24 h; JIS Z 3284:1994, Annex 9 |
| Stencil life | More than 8 | hours | Consistent transfer; 25 deg C, 30% RH |
| Cold slump | Pass | No bridging above 0.20 mm; 25 deg C, 50% RH; IPC J-STD-005A | |
| Hot slump | Pass | No bridging above 0.25 mm; 150 deg C for 10 min; IPC J-STD-005A | |
| Print speed | 25 to 150 | mm/s | Process guideline |
| Refrigerated shelf life | 6 | months | 0 to 10 deg C |
After-processing / final-state properties
Electrical and corrosion results apply only to the stated test conditions and methods.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Automotive damp-heat SIR | >=1 x 10^8 | ohm | 50 V; 6 days; IEC 6068-2-30 |
| Surface insulation resistance | >=1 x 10^8 | ohm | 7 days; 85 deg C/85% RH; 12 V; IPC J-STD-004C / TM-650 2.6.3.7 |
| Surface insulation resistance | >=1 x 10^8 | ohm | 7 days; 40 deg C/90% RH; down to 100 um spacing; JIS Z 3197 / IPC J-STD-004B |
| Bono corrosion | Pass; corrosion factor less than 2 | % | 15 days; 85 deg C/85% RH; Bono criteria |
| Electrochemical migration | Pass | No visual corrosion, discoloration, or electromigration; 596 h; IPC J-STD-004B |
