CNP OM565
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Low-Temperature 175 deg C Reflow
- 01005 Fine-Feature Printability
- Eight-Hour Stencil Stability
Product Description
ALPHA OM-565 HRL3 Solder Paste is a zero-halogen, no-clean, low-temperature solder paste formulated with the HRL3 alloy. Its 175 deg C target peak reflow temperature addresses warpage-related assembly defects in temperature-sensitive chip-scale packages. The product is available with Type 4, Type 5 and Type 6 powders for fine-feature printing down to 01005 component size. It also provides an eight-hour stencil life under ambient and elevated conditions and reflows in either air or nitrogen for lead-free package assembly.
Key features
- 175 deg C Target Reflow: uses a low-temperature HRL3 process for temperature-sensitive package assembly
- 01005 Fine-Feature Printing: handles fine-feature stencil printing with Type 4, Type 5 and Type 6 powder options
- Eight-Hour Stencil Life: maintains consistent transfer efficiency at ambient and elevated test conditions
Applications
Low-temperature surface-mount assembly of warpage-sensitive chip-scale and other lead-free component packages.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
Values apply to the ALPHA OM-565 HRL3 base product; powder size and package vary by configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Alloy | HRL3 | Published product configuration | |
| Powder size | Type 4, Type 5, Type 6 | Published product options | |
| Flux classification | ROL0 | IPC J-STD-004B | |
| Tack retention | Pass | 24 hours at 25%, 50% and 75% RH; IPC J-STD-005 / IPC-TM-650 2.4.44 | |
| Stencil life, ambient | 8 | hours | Consistent transfer efficiency at 25 deg C/50% RH |
| Stencil life, elevated | 8 | hours | Consistent transfer efficiency at 32 deg C/70% RH |
| Cold slump | Pass; no bridging above 0.20 | mm | 25 deg C/50% RH; IPC J-STD-005A |
| Hot slump | Pass; no bridging above 0.25 | mm | 128 deg C for 10 minutes; IPC J-STD-005A |
After-processing / final-state properties
Results apply to reflowed ALPHA OM-565 HRL3 under the listed electrical and residue test conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Surface insulation resistance | >=1.0 x 10^8 | ohm | 7 days at 40 deg C/93% RH; JIS Z 3197:1999 8.5.3 |
| Surface insulation resistance | >=1.0 x 10^8 | ohm | 7 days at 85 deg C/85% RH and 12 V; IPC J-STD-004C / IPC-TM-650 2.6.3.7 |
| Surface insulation resistance | >=1.0 x 10^8 | ohm | 7 days at 40 deg C/90% RH; down to 100 um spacing; IPC J-STD-004B / IPC-TM-650 2.6.3.7 |
| Bellcore surface insulation resistance | >=1.0 x 10^11 | ohm | 5 days at 65 deg C/85% RH; Bellcore GR-78 Core, Section 13 |
| Electrochemical migration | Pass; no visible corrosion, discoloration or migration | 596 hours; IPC J-STD-004B / IPC-TM-650 2.6.14.1 | |
| Post-reflow residue dryness | Pass; non-sticky | Talc test; JIS Z 3197 |
