COOLTHERM EP-6008
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- 8,000 cP Resin Viscosity
- 1-Hour Working Window
- 0.3 W/(m K) Thermal Interface
Product Description
CoolTherm® EP-6008 BLK Epoxy Resin is a black, filled epoxy resin formulated for use with compatible CoolTherm® or Thermoset™ hardeners to create two-component potting and encapsulation systems. The material is designed to flow around intricate and densely packaged circuitry while forming a rigid, electrically insulating cured compound. When combined with CoolTherm EP-6010 Hardener, the system provides a typical cured thermal conductivity of 0.3 W/m·K, a working life of 1 hour at 25 °C, and documented operating-temperature capability from -55 to 155 °C.
Key features
- General-purpose encapsulation: Forms a two-component epoxy compound for potting and encapsulating intricate or densely packaged circuitry.
- Low-viscosity resin: The resin has a typical viscosity of 8,000 cP at 25 °C to support flow around electronic components.
- Electrical and thermal performance: The cured EP-6008 BLK/EP-6010 system provides typical thermal conductivity of 0.3 W/m·K and dielectric strength of 17.7 kV/mm.
Applications / Suitable for
- General-purpose electronic potting and encapsulation
- Intricate and densely packaged circuitry
- Electrical assemblies requiring rigid, electrically insulating encapsulation
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Mechanical Properties
Chemical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical properties of CoolTherm EP-6008 BLK resin and the EP-6008 BLK/EP-6010 mixed system before cure. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Black liquid | — | CoolTherm EP-6008 BLK resin as supplied |
| Viscosity | 8,000 | cP | Resin at 25 °C; test method not stated |
| Specific gravity | 1.55 | — | Resin at 25 °C |
| Working life | 1 | hour | EP-6008 BLK/EP-6010 mixed system at 25 °C |
| Cure time | 12 or 2 | hours | EP-6008 BLK/EP-6010 system: 12 hours at 25 °C or 2 hours at 65 °C |
| Shelf life | 1 | year | EP-6008 BLK resin stored at 25 °C in the original, unopened container |
After-processing / final-state properties
Typical cured properties of the CoolTherm EP-6008 BLK/EP-6010 epoxy system. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 0.3 | W/m·K | EP-6008 BLK/EP-6010 cured system; test method not stated |
| Operating temperature range | -55 to 155 | °C | Documented system operating range; retained individual properties are not stated |
| Hardness | 85 | Shore D | EP-6008 BLK/EP-6010 cured system; test method not stated |
| Dielectric strength | 17.7 (450) | kV/mm (V/mil) | EP-6008 BLK/EP-6010 cured system; specimen thickness and test method not stated |
