COOLTHERM EP 6972 KIT
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Electrically Conductive Bonding
- 2.13 W/(m K) Thermal Conductivity
- One-Hour Working Window
Product Description
CoolTherm® EP-6972 Electrically Conductive Epoxy Adhesive is a two-component, silver-filled epoxy adhesive for electrically conductive bonding and general circuit-board repair. The resin and hardener mix 1:1 by weight and may be applied manually or with meter-mix-dispense equipment before elevated-temperature cure. The cured adhesive has documented electrical and thermal conductivity, with typical volume resistivity below 0.0005 ohm·cm and thermal conductivity of 2.13 W/m·K. Supported substrates include epoxy laminate circuit boards, copper, aluminum, solder, alumina, and glass, with a documented operating range from -50°C to 150°C.
Key features
- Conductive epoxy bond: Typical cured volume resistivity is below 0.0005 ohm·cm and thermal conductivity is 2.13 W/m·K.
- Production-ready 1:1 mix: The resin and hardener mix 1:1 by weight with more than one hour of working life at 25°C.
- Circuit-board repair: Documented substrates include epoxy laminate, copper, aluminum, solder, alumina, and glass.
Applications / Suitable for
- General circuit-board repair
- Electrically conductive bonding
- Bonding to epoxy laminate, copper, aluminum, solder, alumina, and glass
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied values unless otherwise stated. These values are not sales specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance, resin | Silver paste | N/A | As supplied |
| Appearance, hardener | Silver paste | N/A | As supplied |
| Mix ratio | 1:1 | parts by weight | Resin : hardener |
| Specific gravity, resin | 3.49 | N/A | As supplied |
| Specific gravity, hardener | 3.55 | N/A | As supplied |
| Specific gravity, mixed | 3.52 | N/A | After mixing |
| Working life | >1 | h | 100 g mass at 25°C |
| Cure options | 40 min at 85°C; 20 min at 100°C | N/A | Time after material reaches target temperature |
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After-processing / final-state properties
Typical final-state values under the stated conditions. These values are not sales specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Volume resistivity | <0.0005 | ohm·cm | ASTM D257 at 25°C |
| Thermal conductivity | 2.13 | W/m·K | Typical cured value |
| Hardness | 80 | Shore D | Typical cured value |
| Lap shear strength | 1,200 | psi | Aluminum-to-aluminum |
| Operating temperature range | -50 to 150 | °C | Documented range |
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