COOLTHERM MD-140
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 12 W/(m K) Thermal Conductivity
- 72-Hour Working Window
- Fast 120 to 180 deg C Cure
Product Description
CoolTherm® MD-140 Conductive Adhesive is a one-part, silver-filled conductive adhesive for thermally demanding die-attach applications, including microprocessors, power semiconductors, and VLSI assemblies. The silver paste has a typical 36,000 cP viscosity at 25°C and supports syringe dispensing of fine dots or lines using time/pressure, positive-displacement, or linear dispense heads. After a syringe is loaded into dispensing equipment at room temperature, the documented working life is up to 72 hours. The adhesive cures in 5–10 minutes at 120°C, 3–5 minutes at 150°C, or 1–3 minutes at 180°C. Typical cured properties include 12 W/m·K thermal conductivity, 0.9 × 10-4 ohm-cm volume resistivity, and 7,000 psi die-shear strength at 25°C.
Key features
- Silver-filled adhesive providing both thermal and electrical conductivity
- Designed for microprocessor, power-semiconductor, and VLSI die attachment
- 36,000 cP viscosity for accurate syringe dispensing of fine dots or lines
- Up to 72 hours of working life after loading a syringe into dispensing equipment at room temperature
- Fast heat cure from 120°C to 180°C
- Low documented extractable chloride, sodium, and potassium levels
- Documented adhesion to silicon, silver, gold, and copper
Applications
- Microprocessor die attach
- Power-semiconductor die attach
- VLSI and demanding semiconductor or hybrid assembly
- Large-die attachment requiring a low-stress conductive adhesive
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Electrical Properties
Thermal Properties
Additional Information
CoolTherm® MD-140 Conductive Adhesive
A one-part, silver-filled conductive adhesive for thermally demanding semiconductor die attachment. MD-140 supports high-speed syringe dispensing of fine dots and lines and provides simultaneous heat transfer, electrical conduction, and mechanical attachment for microprocessors, power semiconductors, VLSI assemblies, and large die.
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Dispensable silver-paste properties
The adhesive is supplied as a frozen, one-part silver paste. The viscosity value is tied to the published Brookfield CP52 test at 10 rpm and 25°C.
| Property | Typical value | Context |
|---|---|---|
| Appearance | Silver paste | One-part syringe-dispensable adhesive. |
| Viscosity at 25°C | 36,000 cP | Brookfield CP52, 10 rpm. |
| Specific gravity | 3.7 | Typical as-supplied value. |
| Working life after syringe loading | Up to 72 hours at room temperature | Applies after the syringe is loaded into dispensing equipment. |
Thaw upright, purge the dispense system, apply fine dots or lines, and heat cure
Before dispensing, warm the frozen syringe to room temperature, ideally 20–25°C, while keeping it vertical with the dispense tip facing downward. Do not accelerate thawing with ovens, hot plates, hot-air guns, warm water, or other artificial heat sources.
- Typical thaw time for a 3–10 cc syringe is 75 minutes; package size affects thaw time.
- Remove surface moisture before use and manually purge any normal tip-area air.
- Install the syringe on thoroughly cleaned equipment and purge until an unbroken adhesive flow is obtained.
- Use time/pressure, positive-displacement, or linear dispense heads for fine dots or lines.
- Cure for 5–10 minutes at 120°C, 3–5 minutes at 150°C, or 1–3 minutes at 180°C.
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Allow the syringe to reach 20–25°C naturally with the tip facing down.
Remove condensation and purge tip air and the dispense path until flow is continuous.
Apply the validated dot or line pattern with suitable syringe-dispense equipment.
Count cure time after the adhesive reaches 120°C, 150°C, or 180°C.
Frozen storage and handling
Shelf life is six months from the date of manufacture when stored at -40°C in the original unopened container. Store syringes vertically with the dispense tip facing down; do not store horizontally. Transfer received material promptly to -40°C storage, use first-in/first-out inventory control, and wear insulated gloves when handling frozen syringes. Review the current SDS and label before use.
Thermal, electrical, mechanical, and ionic properties
The cured-property values were reported after a two-hour cure at 150°C for analysis. Die-shear strength is a tested joint result and must not be treated as universal bond strength for every die size, metallisation, substrate, bondline, or cure profile.
| Property | Typical value | Context |
|---|---|---|
| Thermal conductivity | 12 W/m·K | Bulk cured-material value; installed thermal resistance also depends on bondline and interfaces. |
| Volume resistivity at 25°C | 0.9 × 10-4 ohm-cm | Bulk-material electrical property. |
| Coefficient of linear thermal expansion | 60 ppm/°C α1; 190 ppm/°C α2 | Regions relative to the glass transition require design interpretation. |
| Glass transition temperature | 82°C | By DMA. |
| Die-shear strength at 25°C | 7,000 psi | Tested die-attach result; exact specimen configuration is not stated in the TDS. |
| Storage modulus at 25°C | 3,300 MPa | Cured-material modulus under the supplier test condition. |
| Extractable chloride | <50 ppm | Extractable ionic-contaminant result. |
| Extractable sodium | <5 ppm | Extractable ionic-contaminant result. |
| Extractable potassium | <1 ppm | Extractable ionic-contaminant result. |
Conductive die attachment for semiconductor and hybrid assemblies
MD-140 is directly positioned for microprocessor, power-semiconductor, and VLSI die attach, including large die. The documented substrate scope includes silicon, silver, gold, and copper. Each assembly requires validation of metallisation, surface preparation, die area, bondline, dispense pattern, cure tolerance, electrical current, heat flow, and reliability conditions.
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Electronic Materials Handling Instructions — -40°C Storage
UI3022 provides frozen-storage orientation, insulated-glove guidance, first-in/first-out handling, ambient thawing requirements, typical thaw times, condensation removal, and syringe-tip purging instructions for electronic materials stored at -40°C.
The document is a general electronic-materials handling instruction. Use it with the MD-140 TDS, current SDS, product label, package size, and approved site procedure.
Validate MD-140 for your die-attach process
Krayden can help review frozen-material handling, thawing, syringe life, dispense-head selection, dot or line geometry, substrate and metallisation compatibility, bondline, cure profile, thermal and electrical requirements, and die-attach qualification for CoolTherm® MD-140.
