COOLTHERM SC-104
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- 0.8 W/(m K) Thermal Encapsulation
- 7,000 cP Mixed Viscosity
- 17.3 kV/mm Dielectric Strength
Product Description
CoolTherm® SC-104 Thermally Conductive Silicone Encapsulant is a two-component, addition-curing polydimethylsiloxane system for electrical and electronic encapsulation. The resin and hardener mix at a 1:1 ratio by weight or volume to form a gray liquid with a typical viscosity of 7,000 cP at 25°C. The material may be cured at room temperature or with heat and develops a flexible silicone elastomer with typical thermal conductivity of 0.8 W/m·K, dielectric strength of 17.3 kV/mm, and resistance to thermal shock.
Key features
- Thermally conductive encapsulation: Provides typical cured thermal conductivity of 0.8 W/m·K using the Hot Disc Transient Method.
- Low-stress silicone cure: Exhibits low shrinkage and stress on components while providing documented thermal-shock resistance.
- Processing flexibility: Supports a 1:1 mix ratio by weight or volume and room-temperature or accelerated heat-cure schedules.
Applications / Suitable for
- Electrical and electronic encapsulation
- Encapsulation applications requiring thermal conductivity and electrical insulation
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Mechanical Properties
Chemical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical properties of CoolTherm SC-104 resin, hardener, and mixed encapsulant before cure. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | White liquid / Black liquid / Gray liquid | — | Resin / hardener / mixed system |
| Viscosity | 6,000 / 6,000 / 7,000 | cP | Resin / hardener / mixed system at 25°C; test method not stated |
| Specific gravity | 2.10 / 2.10 / 2.10 | — | Resin / hardener / mixed system; test conditions not stated |
| Mix ratio | 1:1 | Resin:hardener | By weight or volume |
| Gel time | 60 | minutes | Mixed system at 25°C; test method not stated |
| Working life | 50 | minutes | Mixed system at 25°C; test method not stated |
| Cure schedule | 24 hours / 25–30 minutes / 10–15 minutes | — | At 25°C / 70°C / 100°C; time begins after the material reaches the target temperature |
| Shelf life | 9 | months | Each component from date of manufacture when stored at 25°C in the original, unopened container |
After-processing / final-state properties
Typical cured properties of CoolTherm SC-104. Values were measured after curing for 16 hours at 25°C followed by 2 hours at 100°C and are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 0.8 | W/m·K | Hot Disc Transient Method |
| Coefficient of linear thermal expansion | 160 | ppm/°C | ASTM C864; temperature region not stated |
| Hardness | 65 | Shore A | ASTM D2240 |
| Tensile strength | 480 | psi | ASTM D412 |
| Elongation at break | 120 | % | ASTM D412 |
| Moisture absorption | 0.1 | % | ASTM D570-81 |
| Volume resistivity | 2.2 × 1015 | ohm-cm | ASTM D257 at 25°C |
| Dielectric strength | 17.3 (440) | kV/mm (V/mil) | ASTM D149 |
| Dielectric constant | 3.06 | — | At 25°C and 1 MHz; ASTM D150 |
| Dissipation factor | 0.0075 | — | At 25°C and 1 MHz; ASTM D150 |
