DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Low viscosity for flow into small gaps and complex PCB assembly spaces
- Soft, low-stress encapsulation during thermal cycling
- UL 94 V-0 and UL RTI rated at 150°C
Product Description
DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a two-part, 1:1 mix ratio silicone encapsulant designed for potting printed circuit board system assemblies. It provides 1,700 cP mixed viscosity, 43 Type 000 durometer, 0.5 W/mK thermal conductivity, and UL 94 V-0 flame classification while supporting low-stress encapsulation and room-temperature or heat-accelerated processing. This makes it a candidate for PCB modules, junction boxes, power conversion devices, and railway PCB system applications, subject to application-specific testing and qualification.
Key features
- Low mixed viscosity - 1,700 cP mixed viscosity supports flow into small gaps and complex PCB assembly spaces.
- Soft cured profile - 43 Type 000 durometer supports low internal stress during thermal cycling.
- Flexible cure options - Cures in 3 hours at 25°C or 20 minutes at 50°C for room-temperature or heat-accelerated processing.
- Moderate thermal conductivity - 0.5 W/mK thermal conductivity supports heat dissipation in encapsulated assemblies.
- Electrical insulation - 350 V/mil dielectric strength and 1E+15 ohm*cm volume resistivity support electrical protection.
- Listed flame and rail data - UL 94 V-0, UL RTI rating 150°C, and EN45545-2 R22/R23/R24/R25/R26 HL3 are listed in Dow literature.
Applications / Suitable for
DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is suitable for electronics assemblies where soft encapsulation, flowability, electrical insulation, and environmental protection are required.
- Power conversion devices: Suitable for inverters, converters, and related PCB assemblies requiring silicone encapsulation.
- Junction boxes: Suitable for junction box potting where low-stress filling and environmental protection are needed.
- Automotive PCB modules: Suitable for PCB module protection where soft cured silicone encapsulation is required.
- Railway PCB systems: Suitable for railway PCB system applications where the listed EN45545-2 HL3 certification is relevant.
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Technical Specifications
No specifications available.
Additional Information
DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a two-part, 1:1 mix ratio, addition-cure silicone encapsulant for potting printed circuit board system assemblies. With 1,700 cP mixed viscosity, 43 Type 000 durometer, 0.5 W/mK thermal conductivity, and UL 94 V-0 flame classification, it is designed for applications requiring soft encapsulation, low internal stress, electrical insulation, and environmental protection.
Low-stress encapsulation for PCB system assemblies
The material combines low viscosity, soft cured hardness, electrical insulation, and moderate thermal conductivity for potting applications where the encapsulant must flow around board-level features while limiting internal stress. It is designed for power conversion devices, junction boxes, automotive PCB modules, and railway PCB systems, with final use subject to customer testing and qualification.
Designed for inverters, converters, and similar PCB system assemblies requiring silicone encapsulation.
Suitable for junction box potting where soft, flowable encapsulation and environmental protection are needed.
Suitable for PCB module potting applications requiring a low-stress silicone encapsulant.
Listed with EN45545-2 R22/R23/R24/R25/R26 HL3 certification for railway application review.
Key material data
The values below are typical properties from Dow literature and are not intended for use in preparing specifications.
| Property | Unit | Typical value |
|---|---|---|
| Product form | - | Two-part liquid kit |
| Mix ratio | - | 1:1 |
| Composition | - | Polydimethylsiloxane |
| Mixed color | - | Dark grey to black |
| Part A viscosity | cP | 1,400 |
| Part B viscosity | cP | 2,000 |
| Mixed viscosity | cP | 1,700 |
| Working time at 25°C | minutes | 30 |
| Gel time at 22°C | minutes | 50 |
| Gel time at 50°C | minutes | 6 |
| Cure time at 25°C | hours | 3 |
| Cure time at 50°C | minutes | 20 |
| Durometer | Type 000 | 43 |
| Thermal conductivity | W/mK | 0.5 |
| Cured specific gravity | g/cm3 | 1.48 |
| Water absorption | % | 0.13 |
| Glass transition temperature | °C | -114 |
Electrical insulation and agency listing data
DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is electrically insulative and includes listed UL and EN45545-2 data for application review.
| Property | Unit | Typical value or listing |
|---|---|---|
| Dielectric strength | V/mil | 350 |
| Dielectric strength | kV/mm | 14 |
| Volume resistivity | ohm*cm | 1E+15 |
| Dielectric constant at 100 Hz | - | 2.7 |
| Dielectric constant at 100 kHz | - | 2.7 |
| Dielectric constant at 1 MHz | - | 2.7 |
| UL flame class | - | UL 94 V-0 |
| HWI | PLC | 4 |
| HAI | PLC | 1 |
| CTI | PLC | 0 |
| UL RTI rating 150°C | RTI Elec / RTI Imp / RTI Str | 150 / 150 / 150 |
| EN45545-2 certification | - | R22 / R23 / R24 / R25 / R26, HL3 |
Mix, dispense, cure, and repair considerations
The 1:1 mix ratio supports manufacturing robustness. Dow literature states that de-airing is not required in most cases, although care should be taken to minimize air entrapment.
The encapsulant cures in 3 hours at 25°C or 20 minutes at 50°C, supporting room-temperature cure or heat-accelerated cure process options.
Applications requiring adhesion may require priming. Cured silicone encapsulant can be selectively removed by cutting, tearing, scraping, or rubbing during repair work.
Addition-cure silicones can be inhibited by certain materials, including organotin compounds, sulfur-containing materials, unsaturated hydrocarbon plasticizers, and some solder flux residues. A small-scale compatibility test is recommended when a substrate or process material is questionable.
Photovoltaic materials selection guide
This Dow photovoltaic materials selection guide supports broader material comparison for photovoltaic assemblies and related electronics protection needs. It includes product selection data covering material format, viscosity, cure system, mixed relative density, cure time and temperature, color, hardness, and UL ratings.
- Solar cell encapsulants and optical materials
- Electronics encapsulants for PV-related components
- Junction box potting agents
- Frame sealants, junction box adhesives, rail bonding adhesives, and protective coatings
- Property-level comparison data for early application screening
Electronics encapsulant and junction box potting comparison
The selector table below positions DOWSIL™ EE-3200 alongside related Dow silicone encapsulants and junction box potting materials for early screening.
| Name | Viscosity (mPa·s) | Cure system | Relative density, mixed | Cure time / temperature | Color | Shore A / Shore 00 | UL ratings |
|---|---|---|---|---|---|---|---|
| Electronics encapsulant | |||||||
| DOWSIL™ EE-3200 Low Stress Encapsulant | 1,700 | 2-part addition | 1.47 | 3 hours at 25°C; 20 min at 50°C | Dark grey | 43 | UL94: V-0; UL746A: HWI PLC4, HAI PLC1; UL746B: RTI 150 |
| SYLGARD™ 160 Elastomer | 4,500 | 2-part addition | 1.61 | 4 min at 100°C | Dark grey | 55 | UL94: V-0 |
| DOWSIL™ CN-8760 Thermally Conductive Encapsulant | 2,700 | 2-part addition | 1.60 | 40 min at 50°C | Dark grey | 55 | UL94: V-0 |
| DOWSIL™ CN-8760 G Thermally Conductive Encapsulant | 3,200 | 2-part addition | 1.58 | 30 min at 60°C | Grey | 45 | UL94: V-0 |
| DOWSIL™ TC-6015 Thermally Conductive Encapsulant | 4,000 | 2-part addition | 2.25 | 3 hours at 25°C; 30 min at 70°C | Grey | 40 | UL94: V-0; UL746B: RTI 150 |
| Junction box potting agent | |||||||
| DOWSIL™ EE-3200 Low Stress Encapsulant | 1,700 | 2-part addition | 1.47 | 3 hours at 25°C; 20 min at 50°C | Dark grey | 43 | UL94: V-0; UL746A: HWI PLC4, HAI PLC1; UL746B: RTI 150 |
| DOWSIL™ TC-6015 Thermally Conductive Encapsulant | 4,000 | 2-part addition | 2.25 | 3 hours at 25°C; 30 min at 70°C | Grey | 40 | UL94: V-0; UL746B: RTI 150 |
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