DOWSIL ME-4046
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Low-Modulus Cured Encapsulation
- 660 cP Application Viscosity
- One-Hour Cure Cycle
Product Description
DOWSIL™ ME-4046 Encapsulant Clear Kit is a two-part, clear, low-modulus silicone gel encapsulant formerly identified as HIPEC™ Q3-6646. The 1:1 system is documented for protecting and sealing light-emitting diodes and provides low viscosity, long working time, and stress-relieving gel behavior. Part A has a typical viscosity of 660 cP and Part B 630 cP, supporting flow around LED structures before heat cure. A documented cure condition is one hour at 150°C, and the mixed system has a typical specific gravity of 0.97 at 25°C.
Key features
- Low-viscosity two-part gel: Typical viscosities are 660 cP for Part A and 630 cP for Part B.
- 1:1 heat-cure system: The documented cure condition is one hour at 150°C.
- LED protection: The clear low-modulus gel is documented for sealing and protecting LEDs.
Applications / Suitable for
- Sealing and protecting light-emitting diodes
- Low-modulus optical encapsulation
- Stress-relieving protection around LED structures
Technical Specifications
No specifications available.
Additional Information
As-supplied / before-processing properties
Typical as-supplied or mixed-state values unless otherwise stated. These values are not sales specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Product form | Two-part silicone gel | N/A | As supplied |
| Color | Clear | N/A | As supplied |
| Mix ratio | 1:1 | ratio | Part A : Part B |
| Viscosity, Part A | 660 | cP | As supplied |
| Viscosity, Part B | 630 | cP | As supplied |
| Mixed specific gravity | 0.97 | N/A | At 25°C |
| Cure condition | 1 | h | At 150°C |
