DOWSIL ME-4132
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- One-Part Black Microelectronics-Grade Silicone Encapsulant for Sensors
- 138% Cured Elongation
- Low-Modulus Cured Encapsulation
Product Description
DOWSIL™ ME-4132 Encapsulant Black is a one-part, black addition-cure silicone elastomer coating for microelectronic devices that require encapsulation with adhesion, including sensors and wire-bonded integrated circuits. The microelectronics-grade material combines low ionic impurity levels with a low modulus and produces no cure byproducts. Typical as-supplied viscosity is 4,869 cP, and a two-step cure of one hour at 70°C followed by two hours at 150°C is recommended for thicker coatings. After cure, the elastomer has Shore A 33 hardness, 138% elongation, and documented dielectric properties.
Key features
- Microelectronics-grade encapsulant: The one-part black silicone is documented for sensors and wire-bonded integrated circuits.
- Low-modulus cured elastomer: Typical cured modulus is 0.7 MPa with 138% elongation.
- Controlled ionic impurities: Typical values include 0.54 ppm Na+, 0.58 ppm K+, and 2.8 ppm Cl-.
Applications / Suitable for
- Sensor encapsulation
- Wire-bonded integrated circuits
- Die coating for wire-bond packaging
TDS, SDS & Technical Documents
Technical Specifications
No specifications available.
Additional Information
As-supplied / before-processing properties
Typical as-supplied or processing-state values unless otherwise stated. These values are not sales specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Product form | One-part silicone elastomer coating | N/A | As supplied |
| Color | Black | N/A | As supplied |
| Viscosity | 4,869 | cP | Typical |
| Specific gravity | 1.0335 | N/A | Typical |
| Recommended cure, step 1 | 1 | h | At 70°C |
| Recommended cure, step 2 | 2 | h | At 150°C |
| Storage temperature | -25 to -10 | °C | Documented storage range |
After-processing / final-state properties
Typical cured, installed, or in-use values under the stated conditions. These values are not sales specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 33 | Shore A | Typical cured value |
| Tensile strength | 1.0 | MPa | Typical cured value |
| Elongation | 138 | % | Typical cured value |
| Modulus | 0.7 | MPa | Typical cured value |
| Dielectric constant | 2.8 | N/A | At 100 kHz |
| Dielectric strength | 20 | kV/mm | Typical cured value |
| Volume resistivity | 1.5 × 10¹⁵ | ohm·cm | Typical cured value |
| Linear coefficient of thermal expansion | 325 | ppm/°C | TMA |
