DOWSIL TC-8225 Thermally Conductive Gap Filler
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 2.7 W/(m K) Thermal Interface
- Soft, Compressible Silicone Gap Filler
- Automated Dispensing Ready
Product Description
DOWSIL™ TC-8225 Thermally Conductive Gap Filler is a two-part, silicone-based thermal gap filler engineered to provide efficient heat transfer between heat-generating electronic components and heat sinks while protecting sensitive assemblies from mechanical stress. Featuring 2.7 W/m·K thermal conductivity, a 1:1 mix ratio, and a soft Shore 00 hardness of 55, it cures into a compliant silicone elastomer that accommodates uneven surfaces and varying gap heights. Designed for automated dispensing systems, DOWSIL™ TC-8225 delivers reliable thermal management, electrical insulation, and long-term durability for PCB assemblies, automotive electronics, industrial equipment, telecommunications systems, and power electronic applications. :contentReference[oaicite:0]{index=0}
Key features
- High thermal conductivity - delivers 2.7 W/m·K thermal conductivity to efficiently dissipate heat from electronic components to heat sinks.
- Two-part addition-cure system - supplied in a 1:1 mix ratio that cures at room temperature or with heat, without generating cure by-products.
- Soft, compliant gap filler - cures into a low-modulus silicone gel that conforms to uneven surfaces, reducing mechanical stress caused by vibration and thermal expansion.
- Automated dispensing compatible - designed for process line integration using automated meter-mix dispensing equipment for high-volume manufacturing.
- Electrical insulation - provides excellent dielectric strength and volume resistivity while maintaining reliable thermal performance.
- Long-term reliability - formulated to maintain thermal and mechanical performance during temperature cycling up to 150°C, with short-term peak exposure up to 200°C.
Applications
DOWSIL™ TC-8225 Thermally Conductive Gap Filler is designed for electronic assemblies requiring a soft, dispensable thermal interface material that bridges gaps between heat-generating devices and cooling structures while providing electrical insulation and vibration resistance.
- PCB system assemblies – transfers heat from electronic components to metal housings or heat sinks while filling uneven gaps.
- Power electronics – suitable for converters, power supplies, inverters, and other heat-generating electronic modules.
- Automotive electronics – provides thermal management and vibration damping for ECUs, controllers, and lighting systems.
- Telecommunications and industrial equipment – improves thermal performance in networking hardware, communication devices, and industrial control systems.
- LED lighting modules – fills air gaps between LED assemblies and cooling structures to improve heat dissipation and operating reliability.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
DOWSIL™ TC-8225 Thermally Conductive Gap Filler
DOWSIL™ TC-8225 Thermally Conductive Gap Filler is a two-part silicone gap filler designed to transfer heat from PCB assemblies to heat sinks, housings, or cooling structures. With 2.7 W/m·K thermal conductivity, Shore 00 55 softness, and room-temperature or heat-cure capability, it provides reliable thermal management, electrical insulation, and stress relief for electronics requiring automated dispensing integration.
Soft silicone gap filler for PCB thermal management
DOWSIL™ TC-8225 is designed to fill gaps between heat-generating PCB components and cold sources such as aluminum housings or heat sinks. Its soft, compressible silicone matrix helps improve surface wetting and reduce thermal contact resistance while protecting sensitive circuits from mechanical stress.
The material is supplied as a two-part liquid kit with a 1:1 mix ratio and cures into a soft elastomer without exotherm or cure by-products. It is designed for process line integration using automated meter-mix dispensing equipment and can be cured at room temperature or accelerated with heat.
Key features and benefits
- 2.7 W/m·K thermal conductivity - helps transfer heat from PCB devices to heat sinks, chassis, or metal housings.
- Soft, compressible elastomer - conforms to uneven surfaces and helps absorb vibration, shock, and mechanical stress.
- Two-part 1:1 mix ratio - supports consistent processing by weight or volume using meter-mix equipment.
- Room-temperature or heat cure - cures in approximately 120 minutes at 25°C or 10 minutes at 80°C.
- Electrical insulation - provides high volume resistivity and dielectric strength for electronic assembly protection.
- Long-term temperature stability - supports operation from -45°C to 150°C, with short-term peak exposure up to 200°C.
Typical applications
- PCB system assemblies requiring thermal transfer from components to housings or heat sinks.
- Automotive electronics such as control modules, sensors, lighting systems, and power electronics.
- Telecommunications equipment and industrial electronics operating under sustained thermal loads.
- Power supplies, converters, and inverters requiring soft gap-filling thermal interface materials.
- Electronic modules where dielectric insulation, vibration damping, and thermal transfer are required together.
Reliable gap filling for automated electronics assembly
Soft gap-filling performance
Fills uneven gaps between hot components and cooling structures while helping reduce stress on sensitive PCB assemblies.
Automated dispensing ready
Designed for process line integration using automated dispensing and meter-mix equipment.
Long-term silicone reliability
Provides thermal transfer, dielectric insulation, environmental protection, and vibration damping in one silicone material.
Processing and curing
- Mix ratio: two-part system mixed at 1:1 by weight or volume.
- Application method: designed for automated meter-mix dispensing equipment.
- Working time: viscosity increases after mixing; confirm working time under actual production conditions.
- Cure options: cures at 25°C in 120 minutes or can be accelerated at 80°C in 10 minutes.
- Recommendation: mix thoroughly before use; light-colored streaks or marbling may indicate incomplete mixing.
Frequently asked questions
What is DOWSIL™ TC-8225 used for?
It is used as a thermally conductive gap filler to transfer heat from PCB components to heat sinks, chassis, or aluminum housings.
Is DOWSIL™ TC-8225 soft after curing?
Yes. It cures into a soft silicone elastomer with typical Shore 00 hardness of 55, helping provide stress relief and gap filling.
How does DOWSIL™ TC-8225 cure?
It is an addition-cure two-part silicone that can cure at room temperature or be accelerated with heat.
Can it be used with automated dispensing?
Yes. TC-8225 is designed for process line integration with automated dispensing and meter-mix equipment.
What temperature range can it support?
After cure, it is designed for operation from -45°C to 150°C, with short-term peak exposure up to 200°C.
Need help selecting a thermal gap filler?
Whether you are designing PCB assemblies, automotive electronics, power modules, or industrial control systems, our technical team can help evaluate DOWSIL™ TC-8225 for gap size, dispensing process, cure profile, thermal performance, and reliability requirements.
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