LOCTITE ECCOBOND 50400-1
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Low viscosity
- Low CTE
- One component
Product Description
LOCTITE® ECCOBOND 50400-1 glob top is designed for encapsulating wire bonded bare die on epoxy laminate and similar substates. The formulation of this single component material ensures a long pot and a very stable, low viscosity during use.
LOCTITE® ECCOBOND 50400-1 is recommended for use on ICs with high wire profiles and in applications where the spreading of the glob top during cure must be controlled.
Cure Schedule
- 2 hours @ 150°C
Low Stress Cure Schedule
- 1 hour @ 120°C + 1 hour @ 150°C
ECCOBOND 50400-1
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