LOCTITE ECCOBOND 7010C DAM
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Dam
- Low CTE
- High purity
Product Description
LOCTITE ECCOBOND DAM 7010C is a black epoxy semiconductor encapsulant, formulated to be used in combination with a "fill" encapsulant LOCTITE ECCOBOND FIL 7010C as a dam encapsulant. It is specially designed for glob top, chip on board applications where protection of wire bonded bare IC is required. This two material combination is also suited for the protection of multiple chips and for encapsulating components where a well-defined glob height and flat surface are required.
LOCTITE ECCOBOND DAM 7010C has good crack, chemical and thermal resistance along with low thermal expansion. This SVHC free, REACH compliant, high purity, low sag material operates at -40 to 150ºC and is typically used for glob top applications and the encapsulation of bare wire bonded semiconductors.
Cure Schedule
- 2 hours @ 140°C
- 1 hour @ 100°C plus 1 hour @ 150°C (Low Stress)
Recommended Dispensing Settings
- For best results, dispense onto substrate warmed to 80°C, and then optimize by reducing the needle size, dispensing pressure, and speed to achieve the desired dam width and height.
ECCOBOND DAM 7010C
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