LOCTITE ECCOBOND FP4531
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Snap cure
- Fast flow
- Passes NASA outgassing
Product Description
LOCTITE® ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap. It is a snap curable epoxy with fast flow that passes NASA outgassing standards.
LOCTITE® ECCOBOND FP4531 is 62% filled, offers a pretty long pot life and has limited impurities. Its snap cure schedule can vary based on customer's experience and application requirements.
Snap Cure Schedule
- 7 minutes @ 160°C
ECCOBOND FP4531
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Product availability 
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Technical Specifications
General Properties
Pot LifePot Life
24 hoursThermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
161 °CThermal ConductivityThermal Conductivity
0.61 W/m.KPhysical Properties
ViscosityViscosity
10,000 mPa.s
