LOCTITE ECCOBOND FP4547
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Enhanced adhesion
- Rigid, low stress seal
- High purity
Product Description
LOCTITE ECCOBOND FP4547 liquid epoxy underfill is designed to provide enhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 90 to 120°C substrate temperature, with as little as a 2 to 3 mil gap.
When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance. LOCTITE ECCOBOND FP4547 also exhibits low moisture absorption for improved JEDEC performance.
Recommended Cure Schedule
- 30 minutes @ 165°C
ECCOBOND FP4547
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