LOCTITE ECCOBOND FP4549
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Extends thermal cycling performance
- Rigid, low stress
- High purity
Product Description
LOCTITE® ECCOBOND FP4549 liquid epoxy adhesive is designed forenhanced adhesion to integrated circuit passivation materials. LOCTITE® ECCOBOND FP4549 material is formulated to quickly underfill devices at 90°C to 110°C with as little as a 1/2 mil gap.
When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance.
Recommended Cure Schedule
- 30 minutes @ 165°C
ECCOBOND FP4549
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