Name: FREKOTE 44NC
Brand: Henkel Corporation
SKU: FREKOTE 44NC

Main features

Multi-Cycle Mold Release
Reduced Mold-Surface Contamination Risk
Non-Silicone Downstream-Compatible Formulation

Product Description

LOCTITE® FREKOTE® 44NC is a non-silicone, dry-film mold-release coating designed for semiconductor transfer, compression, and injection molds. It provides consistent release, protects mold surfaces from contamination, and minimizes flash or sticking for high-volume production.

Key features

Consistent release: Supports multiple cycles without reapplication under documented mold conditions.
Protective coating: Preserves mold surface integrity and reduces contamination risk.
Non-silicone formulation: Compatible with post-mold processing and downstream packaging.

TDS, SDS & Technical Documents

Technical Specifications

General Properties

Color

Clear Liquid

Specific Gravity

0.76

Thermal Properties

Temperature Resistance

400 ˚C

Additional Information

Semiconductor Mold Maintenance

LOCTITE® FREKOTE® 44NC

Dry-film, non-silicone mold-release coating formulated to protect semiconductor molds, enable clean release, and reduce sticking during transfer and compression molding operations.

Dry-film release Non-silicone Multiple-cycle protection

LOCTITE® FREKOTE® 44NC product container

Illustrative product image

Appearance

Clear / slightly amber film

Dry, non-silicone coating

Form

Aerosol or bulk liquid

Supplied ready for application or spray

Shelf Life

24 months

From date of manufacture, stored in original container

Processing Summary

Application involves spraying or brushing onto clean mold surfaces, followed by brief flash-off before molding cycle start. Multiple thin coats may be applied for extended release performance.

Preparation: Ensure mold surface is free of cured resin or debris; wipe or clean prior to application.

Application: Spray or brush uniformly; allow to flash off. Avoid puddling or thick layering.

Post-application: Inspect for uniform film. Reapply thin layers for extended cycles as required by production.

Release Performance

Multiple molding cycles

Maintains release under recommended mold temperatures

Temperature Range

Up to 175°C

Supports typical semiconductor molding temperatures

Residue

Minimal

Reduces risk of package contamination

Technical Guidance

Issue: Flashing or sticking

Ensure mold is clean, apply thin uniform coat, allow proper flash-off before molding cycle.

Issue: Reduced release after multiple cycles

Reapply a thin layer of FREKOTE® 44NC as per recommended production intervals.

Need Technical Assistance?

Contact Krayden’s technical experts for guidance on mold-release application, process optimization, and product evaluation.

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