Hysol GR2330 | Orange Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

GR2330 Orange Epoxy Mold CompoundHysol GR2330 | Orange Epoxy Mold Compound

Main features

  • For MnO Tantalum Capacitors
  • Orange Colored
  • Orange version of GR2310 and GR2320

Product Description

Hysol GR2330 is an orange semiconductor epoxy molding compound designed for the encapsulation and protection of Manganese Oxide or MnO2 tantalum capacitors and other automotive packages. Once molded and post-mold cured, this product provides optimum protection and reliability for these capacitor devices.

Hysol GR2330 is a laser markable environmentally "green" product, that doesn't contain any halogens including bromine, antimony or phosphorus flame retardants. Hysol's MG-series epoxy molding compounds dominated the space for tantalum capacitors but used halogen-containing flame retardants. This next generation epoxy mold compound replaces these older generation products. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Maganese Oxide MnO2 capacitors. Its fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. Hysol GR2330 meets UL 94 V-0 Flammability at 1/4 inch (6.35mm) thickness.

Product Family

HYSOL GR2330

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Orange
Filler ContentFiller Content
74 %
Specific GravitySpecific Gravity
1.83
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
175 °C
Thermal ConductivityThermal Conductivity
0.65 W/m.K
UL 94 RatingUL 94 Rating
V0
Electrical Properties
Volume ResistivityVolume Resistivity
300000000000000000 Ohms⋅cm
Chemical Properties
Moisture absorptionMoisture absorption
0.45 %
Physical Properties
Spiral Flow @ 175°CSpiral Flow @ 175°C
81 cm
Mechanical Properties
Molded ShrinkageMolded Shrinkage
0.17 %
Curing Conditions
Transfer PressureTransfer Pressure
40 - 85 kg/cm2
Transfer TimeTransfer Time
6 - 15 s

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