GR900 | QFN Epoxy Molding Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Low stress and moisture absorption
- High adhesion
- Low moisture absorption
Product Description
Hysol GR900 is a green molding compound specifically developed for DFN/QFN MSL1 applications. It's designed to provide exceptional performance and reliability. The compound meets the UL94V-0 flammability standard at a thickness of 1/8 inch.
Product Key Features
- Halogen-free
- Low stress — Minimizes stress on delicate electronic components, enhancing long-term reliability.
- High adhesion — Provides a strong bond to the substrate, preventing delamination.
- Low moisture absorption — Reduces the risk of moisture-related defects.
- High reliability — Ideal for demanding applications where durability and performance are critical.
Applications
- DFN/QFNMSL1 Applications
HYSOL GR900
1. Select Pellet Size
2. Select Pellet Weight
Catalog Product
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Product availability 
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeks Shipping in 12 weeks Shipping in 12 weeksTDS, SDS & Technical Documents
Technical Specifications
General Properties
Filler ContentFiller Content
89 %Filler Size CutFiller Size Cut
53 µmSpecific GravitySpecific Gravity
2.00Electrical Properties
Volume ResistivityVolume Resistivity
45e15 Ohms⋅cmPhysical Properties
Spiral Flow @ 175°CSpiral Flow @ 175°C
50 cmThermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
120 °CThermal ConductivityThermal Conductivity
0.9 W/m.K
