Hysol MG52F-99B NXP | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

MG52F-99B NXP Black Epoxy Mold CompoundHysol MG52F-99B NXP | Black Epoxy Mold CompoundMG52F-99B NXP Black Epoxy Mold Compound

Main features

  • MSL 1 260°C
  • Ideal for Cu, & Pd plated leadframes
  • 28, 48 and 56 pin TSSOP

Product Description

Hysol MG52F-99B NXP is a high productivity molding compound, designed for high volume encapsulation of surface mount devices. MG52F-99B NXP is applicable for devices having chip dimensions up to 1 centimeter (400 mils) square. Various versions are available including MG52F. MG52-99B NXP which is designed to provide much improved moisture performance after preconditioning. It can be applied using both conventional and automold equipment.

MG52F-99B NXP was designed for and passed qualification testing on 28, 48 and 56 pin TSSOP packages and has been used in production for more than 20 years. These packages have a copper leadframe with palladium plating. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on copper based, palladium-plated leadframes. Hysol MG52F-99B NXP meets UL 94 V-0 Flammability at 1/8 inch (3.18mm) thickness.

MG52F-99B NXP has high adhesion to a wide range of substrates including Nickel and Palladium, Low stress, fast cure and a large operating window, ideal for low wire sweep molding.

Product Family

HYSOL MG52F-99B

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Black
Filler ContentFiller Content
78.8 %
Specific GravitySpecific Gravity
1.88
Electrical Properties
Volume ResistivityVolume Resistivity
100000000000000000 Ohms⋅cm
Chemical Properties
Moisture absorptionMoisture absorption
0.57 %
Physical Properties
Spiral Flow @ 175°CSpiral Flow @ 175°C
78 cm
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
155 °C
Thermal ConductivityThermal Conductivity
0.95 W/m.K
UL 94 RatingUL 94 Rating
V0
Mechanical Properties
Molded ShrinkageMolded Shrinkage
0.28 %
Curing Conditions
Transfer PressureTransfer Pressure
40 - 100 kg/cm2
Transfer TimeTransfer Time
5 - 30 s

Additional Information

MG52F-99B NXP has passed the following testing:

  • Operating Life Static Test, 125° C, 5.5V 1000 Hours: Passed
  • Biased Humidity, 85° C / 85% R H, 1000 Hours: Passed
  • Autoclave, 121° C, 15 psi, 240 Hours: Passed
  • Temperature Cycle Test, -65° C to 150° C, 1000 Cycles: Passed
  • Storage Life Test, 150° C, 1000 Hours: Passed
  • Thermal Shock Test, -55° C to 125° C, 500 Cycles: Passed
  • Solder Heat, 260° C, 10 Sec, 1 Cycle: Passed
  • Lead Pull to Destruction: Passed
  • X-Ray: Passed

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