LAIRD TFLEX 300
Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other
Main features
- Over 50% Deflection at 50 psi
- 1.2 W/(m K) Thermal Conductivity
- 0.50 to 5.08 mm Thickness Range
Product Description
Tflex™ 300 is a ceramic-filled silicone thermal gap filler designed to conform around components and bridge gaps between heat-generating devices and adjacent cooling surfaces. The light-green pad provides typical thermal conductivity of 1.2 W/m·K and deflects by more than 50% of its original thickness at 50 psi. Its low compression set supports repeated installation, while available thicknesses from 0.50 mm to 5.08 mm address a range of interface geometries. :contentReference[oaicite:0]{index=0}
Key features
- Highly compliant construction: Deflects by more than 50% of its original thickness at 50 psi, supporting conformity around component topography.
- Thermal gap-filling performance: Provides typical thermal conductivity of 1.2 W/m·K when tested according to ASTM D5470.
- Broad thickness availability: Offered from 0.50 mm (0.020 in) to 5.08 mm (0.200 in), with standard and custom-converted formats available.
Applications / Suitable for
- Automotive electronics, infotainment, ADAS, and powertrain or ECU assemblies
- Routers and wireless infrastructure
- Notebooks, tablets, portable devices, gaming systems, and smart-home devices
- Instrumentation and drone or satellite electronics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical uninstalled properties and available dimensions for the Tflex 300 Series. Values are for design guidance and are not guaranteed specifications. :contentReference[oaicite:1]{index=1}
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction and composition | Ceramic-filled silicone sheet | — | Product construction |
| Color | Light green | — | Visual |
| Thickness range | 0.50–5.08 (0.020–0.200) | mm (in) | Nominal uncompressed thickness range |
| Density | 1.78 | g/cc | Helium pycnometer |
| Hardness | 51.4 for 20–30 mil 25.2 for 40 mil and above |
Shore 00 | ASTM D2240; thickness-dependent result |
| Shelf life | 2 | years | From date of shipment; storage conditions not stated on the product page |
After-processing / final-state properties
Typical thermal, electrical, environmental, and installed-interface properties of Tflex 300. Values are not intended as guaranteed design limits. :contentReference[oaicite:2]{index=2}
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.2 | W/m·K | ASTM D5470 |
| Thermal resistance | 0.98 | °C·in²/W | Modified ASTM D5470; 40 mil thickness, 10 psi, 50°C |
| Deflection | >50 | % | At 50 psi; thickness-specific curves are provided in the datasheet |
| Operating-temperature range | -40 to 160 | °C | Documented product temperature range |
| Dielectric constant | 4.5 | — | ASTM D150 at 10 GHz |
| Volume resistivity | 1013 | ohm·cm | ASTM D257 |
| Outgassing | TML: 0.56 CVCM: 0.10 |
wt% | ASTM E595 |
| Flammability rating | V-0 | — | UL 94 |
