LAIRD TFLEX 320H

Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other

LAIRD TFLEX 320H

Main features

  • Dry Preformed Interface Pad
  • No Mixing or Dispensing
  • Controlled-Compression Gap Filling

Product Description

Tflex 320H Thermal Gap Filler is a preformed silicone elastomer sheet for bridging thermal gaps between electronic components and adjacent heat-spreading hardware. The dry pad format supports placement between devices and heat sinks, spreaders, or chassis surfaces without mixing or liquid dispensing. Its sheet construction is suited to assemblies that use controlled compression to maintain interface contact across component-height variation. The sheet format also supports clean, repeatable placement during assembly and service. Applications include electronic component-to-heat-sink and component-to-chassis thermal interfaces.

Key features

  • Dry Preformed Pad: Sheet-format installation avoids liquid mixing, dispensing, and cure steps.
  • Controlled-Compression Interface: The elastomer format supports contact across defined component-to-hardware gaps.
  • Electronics Thermal Gap Placement: The pad is suited to component, heat-sink, spreader, and chassis interfaces.
Product Family

LAIRD TFLEX 320H

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Light green
Component SystemComponent System
Ceramic filled silicone sheet
Density (g)Density (g)
1.78 g/cm3
Thermal Properties
Operating TemperatureOperating Temperature
(-)40 to 160 °C
Thermal ConductivityThermal Conductivity
1.2 W/m.K

Additional Information

1910

Leading Brands Trust in Our Products and Services

  • Jabil
  • Linxens
  • Magna
  • Medtronic
  • NXP
  • Philips
  • Semikron
  • Teledyne
  • Thales
  • Vishay
  • ZF
  • AMS
  • Apple
  • Audi
  • Broadcom
  • Borgwarner
  • Bosch
  • Eaton
  • Henkel
  • Honeywell
  • Hysol
  • Intel
Products that Perform|Knowledge that Serves|Service that Delivers