LAIRD TGON 805
Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other
Main features
- 0.13 mm Flexible Graphite Interface
- 5 W/(m K) Through-Plane Conductivity
- 0.07 deg C in^2/W Thermal Resistance
Product Description
Laird Tgon™ 805 is the 0.13 mm-thick configuration of the Tgon™ 800 Series, a flexible graphite interface pad designed for applications where electrical isolation is not required and both electrical contact and thermal transfer are desired. Its grain-oriented, plate-like graphite structure provides typical thermal conductivity of 5 W/m·K through the Z axis and 240 W/m·K in the X-Y plane. The material contains more than 98% graphite and is available without adhesive or with a thin pressure-sensitive adhesive on one side to aid assembly.
Key Features
- 0.13 mm nominal thickness for thin electrically and thermally conductive interfaces.
- Anisotropic thermal conductivity of 5 W/m·K through-plane and 240 W/m·K in-plane.
- More than 98% graphite construction with low thermal resistance and optional one-side pressure-sensitive adhesive.
Applications / Suitable for
- Power conversion equipment
- Power supplies
- Large telecommunications switching hardware
- Notebook computers
- Applications requiring electrical grounding with thermal conductivity
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied properties for the 0.13 mm Tgon™ 805 configuration of the Tgon™ 800 Series.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Flexible graphite | — | Typical specification |
| Color | Pewter | — | Visual |
| Nominal thickness | 0.005 | in | Equivalent to 0.13 mm |
| Thickness tolerance | ±0.001 | in | Equivalent to ±0.025 mm |
| Density | 2.20 | g/cc | Helium pycnometer |
| Hardness | 85 | Shore A | ASTM D2240 |
After-processing / final-state properties
Typical installed and in-use properties for Tgon™ 805. Thermal resistance is reported at the stated interface pressure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity, Z axis | 5 | W/m·K | ASTM D5470, modified |
| Thermal conductivity, X-Y axis | 240 | W/m·K | ASTM D5470, modified |
| Thermal resistance | 0.07 | °C·in²/W | ASTM D5470, modified; 100 psi |
| Thermal resistance | 0.42 | °C·cm²/W | ASTM D5470, modified; 681 kPa |
| Tensile strength | 650 | psi | ASTM D412 |
| Volume resistivity, in-plane | 11 × 10−5 | ohm·cm | ASTM D257 |
| Temperature range | −240 to 300 | °C | Without adhesive; adhesive-backed material is rated 0 to 120°C |
| UL flammability rating | V-0 | — | UL 94 |
