LAIRD TPCM5200
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 0.200 mm Phase-Change Film
- 5.3 W/m-K Bulk Conductivity
- 25 Micrometer Minimum Bondline
Product Description
Tpcm 5200 Phase Change Thermal Interface Material is a 0.200 mm free-standing, non-silicone thermoplastic film for thin electronic thermal interfaces. The material provides 5.3 W/(m K) bulk thermal conductivity and softens between 50 and 70 deg C, allowing the installed layer to wet mating surfaces and reach a minimum bondline thickness of 25 micrometers under suitable pressure. Its naturally tacky surface supports liner retention and placement, while the polymer matrix is formulated to resist pump-out and permit rework. Applications include semiconductor packages, graphics cards, notebooks, servers, IGBTs, automotive electronics, memory modules, and game consoles.
Key features
- 0.200 mm Free-Standing Film: The Tpcm 5200 configuration provides a thin, liner-handled phase-change interface.
- 5.3 W/(m K) Bulk Conductivity: The filled thermoplastic supports heat transfer through a thin installed layer.
- 50 to 70 deg C Softening: Thermal softening promotes surface wetting and a minimum 25 micrometer bondline.
Applications / Suitable for
- Semiconductor packages and graphics cards
- Notebooks, servers, and memory modules
- IGBT and automotive electronics
- Game consoles
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Exact as-supplied properties for the 0.200 mm Tpcm 5200 configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Free-standing filled non-silicone thermoplastic | Phase-change film | |
| Color | Grey | Visual | |
| Nominal thickness | 0.200 | mm | with a tolerance of 0.025 mm |
| Density | 2.6 | g/cc | Helium pycnometer |
| Storage temperature | 0 to 40 | deg C | Sealed bag; no humidity requirement |
| Shelf life | 1 | year from shipment | Sealed bag |
After-processing / final-state properties
Typical installed phase-change properties for the Tpcm 5000 material used in Tpcm 5200.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Bulk thermal conductivity | 5.3 | W/(m K) | Hot Disk |
| Operating temperature range | -40 to 125 | deg C | Laird test method |
| Softening temperature range | 50 to 70 | deg C | Laird test method |
| Minimum bondline thickness | 25 | micrometers | Laird test method |
| Dielectric constant | 31.2 | 1 MHz; ASTM D150 | |
| Volume resistivity | 1.4 x 10^14 | ohm cm | ASTM D991 |
| Flammability | V-0 | UL 94 |
