BMC-G241 | Black Optocoupler Epoxy Molding Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Good reflectance
- Heat-resistant
- Ideal spiral flow
Product Description
OPTOLINQ BMC-G241 is a coupler epoxy molding compound specifically formulated for encapsulating optoelectronic devices. BMC-G241 offers superior performance and protection for a wide range of optoelectronics applications.
Product Key Features
- Excellent Moldability — Has a suitable spiral flow, allowing for easy and precise molding under various conditions, ensuring consistent and high-quality encapsulation of intricate optoelectronic components.
- High Performance — Features high heat resistance and reflectance, which are crucial for maintaining the performance and longevity of optoelectronic devices.
- Enhanced Reliability — BMC-G241 delivers exceptional reliability, ensuring that encapsulated devices perform consistently and have a long operational lifespan.
Applications
OPTOLINQ BMC-G241 is ideal for applications requiring the reliable encapsulation of optoelectronic devices, including:
- Optocouplers
- Sensors
OPTOLINQ BMC-G241 is recommended for use in conjuction with CHEMLINQ semiconductor mold maintenance products to ensure proper release from mold dies.
LINQ BMC-G241
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