Loctite 9432 NA Epoxy Adhesive

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Loctite 9432 NA Epoxy Adhesive

Main features

    Product Description

    LOCTITE® EA 9432NA (also known as Hysol® Adhesive 9432NA) is an aluminum-filled, thixotropic, one-component epoxy adhesive. It is formulated to provide excellent tensile shear strength over a wide temperature range and a high degree of impact resistance. Designed to cure at moderate temperatures, it maintains a long shelf life at room temperature and can easily be pumped and dispensed without sagging.

    Product Key Features

    • One-Component System - requires no mixing, simplifying application and handling.
    • Thixotropic Non-Sag Paste - dispenses easily onto parts without slumping or sagging, even on vertical surfaces.
    • Heat Cure - cures in 60 minutes at 120°C/250°F or achieves a faster cure in 30 minutes at 150°C/300°F.
    • Robust Mechanical Profile - delivers a Shore D hardness of 90, a tensile strength of 50 MPa, 1.2% elongation, and a high modulus of 4690 MPa/ 680,000 psi.
    • Excellent Resistances - provides excellent high-temperature performance and robust chemical resistance to various environmental exposures.

    Applications

    This adhesive fits applications requiring the bonding of a wide variety of substrates, offering exceptional tolerance to poorly prepared surfaces.

    • Metal Bonding: Bonds effectively to etched or degreased aluminum, as well as cold rolled steel, even when the steel is oily or poorly prepared.
    • Composite Assemblies: Suitable for bonding various composites, including fiberglass SMC and fiberglass vinyl ester laminates.
    Product Family

    LOCTITE 9432 NA

    Catalog Product

    Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

    TDS, SDS & Technical Documents

    Technical Specifications

    General Properties
    ColorColor
    Gray
    DensityDensity
    1.38 kg/m3
    Specific GravitySpecific Gravity
    1.38
    Mechanical Properties
    ElongationElongation
    1.2 %
    Physical Properties
    ViscosityViscosity
    150,000-300,000 mPa.s

    Additional Information

    One-Component Aluminum Filled Epoxy Adhesive

    LOCTITE™ EA 9432NA

    LOCTITE™ EA 9432NA (formerly known as Hysol® Adhesive 9432NA) is an aluminum-filled, thixotropic, one-component epoxy adhesive system engineered for high-performance structural bonding. Formulated to deliver outstanding tensile shear strength across a wide temperature range, this high-toughness compound provides exceptional impact resistance. It exhibits a unique tolerance for oily or poorly prepared surfaces and easily pumps or extrudes without slumping. Designed to cross-link rapidly under moderate bake temperatures, it ensures long shelf life stability and provides maximum reliability for demanding assembly workflows.

    One-component (No mixing) 30 min cure at 150°C Aluminum filled paste Tolerant to oily surfaces
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    Typical engineering parameters only. Cross-linking requires a thermal activation cycle; property profiles depend on explicit baking temperatures.

    LOCTITE EA 9432NA Adhesive product package
    LOCTITE™ EA 9432NA

    Key Features

    • Single-component formulation eliminates manual blending or volumetric tracking machinery, reducing error and scrap.
    • Thixotropic non-sag paste consistency yields clean tracking and stands up to a maximum of 0.3" slump on vertical profiles at 150°C.
    • Maintains high engineering shear strength (up to 26.2 MPa) across a wide range of hot and sub-zero environments.
    • Surface preparation tolerant, delivering robust structural bonding onto oily metals and poorly cleaned substrates.
    • Aluminum-filled epoxy grid develops superior hardness (90 Shore D) paired with maximum chemical and fluid immunity.
    • Addition cross-linking proceeded evenly throughout deep sections without generating corrosive volatile by-products.

    Processing Summary

    Thermal Cure Options: Curing proceeds smoothly at moderate thresholds tracking 60 minutes at 120°C. Processing cycle throughput can be accelerated to 30 minutes by raising oven environments to 150°C.
    Exotherm Mitigation: Large masses of uncured compound can exotherm intensely during baking. Avoid curing static masses greater than 10 grams; thin film lines in bond areas remain completely safe.
    Viscosity Rheology: Formulated as a thixotropic gray compound with a supplied viscosity scope measuring between 150,000 and 300,000 cP for reliable, easy pumping.
    Contact Pressure: Parts must be held in contact and fixed continuously until full cure completes. A joint clamping pressure of 15 psi is recommended to maintain exact substrate seating.
    Handling and Application Guidance

    Process Notes 

    Storage and Refrigeration
    • Ideally store material in cool, dry areas within unopened container vessels between 2° to 8°C (36° to 46°F).
    • Refrigerated packages must be allowed to completely return to room temperature prior to starting application cycles.
    • To avoid moisture contamination of the remaining stock, do not return any unused paste back into its original package.
    Surface Preparation & Limits
    • While surface-tolerant, best bond profiles require clean, dry faces cleared of thick scaling or loose particles.
    • This epoxy grid system is not recommended for use in pure oxygen or oxygen-rich application systems.
    • Do not select or configure this compound as an industrial sealant for liquid chlorine or other strong oxidizing agents.
    Clean Up & Removal
    • Uncured squeeze-out or overspray can be wiped from line components using common industrial solvents or citrus cleaners.
    • Review your fluid supplier's documentation regarding safe handling, ventilation, and flashing risks for cleaning solvents.
    • Once fully cross-linked via oven heating, this high-adhesion structural bond becomes extremely difficult to remove.
    Typical Properties

    Engineering Data for LOCTITE™ EA 9432NA

    Physical & Cured Mechanical Characteristics

    Physical Property Typical Engineering Value Test Method Standard Basis
    Appearance / Color Thixotropic paste / Gray -
    Viscosity 150,000 - 300,000 cP -
    Specific Gravity 1.38 Measured at 77°F (25°C)
    Density 1.38 g/cm3 Measured at 77°F (25°C)
    Hardness 90 Shore D -
    Tensile Strength 50 MPa ASTM D 638
    Tensile Modulus 4690 MPa ASTM D 638
    Ultimate Elongation 1.2 % ASTM D 638

    Tensile Shear Strength over Varied Temperatures

    Lap joints prepared with Etched Aluminum per ASTM D 1002, cured for 30 minutes at 150°C.1

    Testing Ambient Temperature (°F) Typical Shear Value (MPa/psi) Thermal Performance Level
    55°C (-67°F) 24 / 3,500 Cryogenic sub-zero hold stability
    25°C (77°F) 26.2 / 3,800 Standard room temperature baseline validation
    120°C (250°F) 20.6 / 3,000 Elevated continuous structural threshold
    150°C (300°F) 16.5 / 2,400 High temperature operating limit
    176.5°C (350°F ) 2.75 / 400 Extreme thermal limit values
    204.5°C (400°F) 2.75 / 400 Extreme thermal limit values

    Surface Tolerance & Substrate Bond Performance

    Tested at 77°F per ASTM D 1002 protocols after a 30-minute cross-linking cycle at 150°C.

    Substrate Matrix Profile Surface Preparation Protocol Typical Shear Strength (Mpa/psi)
    Degreased Aluminum Standard chemical solvent clean 24 / 3,500
    Cold Rolled Steel (Abraded) Mechanical grit abrasion + wipe 20.6 / 3,000
    Cold Rolled Steel (Degreased) Solvent clean only (No abrasion) 19.6 / 2,850
    Cold Rolled Steel (Oily) Untreated mill oil residue surface 18 / 2,600
    Fiberglass SMC (Vinyl Ester Laminate) Standard compound surface clean 6.9 / 1,000
    Fiberglass SMC (Owens Corning) Standard clean matrix boundaries 2.75 / 400 
    Fiberglass SMC (Budd Co) Standard clean matrix boundaries 2.7 / 380
    Environmental Fluid Resistance Profile: Lap shear joints processed on 16 gauge sandblasted cold rolled steel (5 mil bondline) maintain robust load values at 25°C (77°F) following a complete 30-day continuous immersion soak across automotive chemicals including water, 10W40 motor oil, 50% ethylene glycol (ambient and boiling lines), brake fluid, automatic transmission fluid, gasoline, and diesel fuel.
    LOCTITE® EA 9432NA Strength Developments at various temperatures 

    Applications

    Where LOCTITE™ EA 9432NA Fits

    Automotive sheet steel panel stamping assembly loop
    Contaminated Substrate Joints
    Perfectly optimized for industrial processing areas where strict mechanical surface abrasion or heavy solvent degreasing is impossible or impractical.
    • Cures reliably straight through protective mill oil residues.
    • Maintains high structural shear thresholds (2,600 psi) on oily steel.
    • Bypasses extensive chemical surface conditioning line pre-steps.
    High temperature industrial electronics structural assembly
    Extreme Thermal Operating Zones
    Engineered to deliver heavy mechanical structural load holding capacities when exposed to sustained thermal environments up to 150°C (300°F).
    • Retains an impressive 2,400 psi shear capacity at 150°C (300°F).
    • Resists physical degradation under prolonged hot air aging.
    • Maintains stable mechanical strength under severe thermal shock cycles.
    Vertical structural seam assembly dispensing epoxy paste
    Vertical & Overhead Seams
    High thixotropic paste rheology makes this adhesive highly dispensable via automatic pump systems while remaining non-sag on perpendicular joint faces.
    • Easily pumped and dispensed onto complex parts.
    • Bead tracking stays completely immune to running risks.
    • Limits gravity slump to a tight 0.3" maximum during heat bakes.
    Package & Support

    Standard Packaging & Technical Help

    Standard Packaging
    • Supplied ready-to-use inside standard industrial packaging and cartridge configurations.
    • Single-component paste system requires no automated static or dynamic nozzle mixing valves.
    • Original containers preserve long-term product shelf life stability under cold storage control.
    Technical Help Capabilities
    • Designing optimized thermal profiles to enable accelerated 30-minute high-temperature bonding lines.
    • Auditing custom part geometries and line setups to safely isolate and manage exothermic mass reactions.
    • Configuring high-pressure pump feed parameters matching specified compound viscosities (150k-300k cP).
    • Support for localized test coupon trials to verify target cohesive failure lap shear limits.
    Technical Guidance

    Tips and Troubleshooting

    Issue Recommended Action
    Material demonstrates excessive joint squeeze-out or gravity slump inside the heating oven
    • Ensure total batch stock returns fully to ambient room temperature before triggering extrusion cycles.
    • Verify that the assembly line clamping fixtures maintain a steady, uniform pressure profile of 15 psi.
    • Monitor localized heating limits; check that vertical slump parameters remain under the 0.3" max threshold at 150°C (300°F).
    Material mass chars, bubbles, or alters substrate shape during high-temperature bakes
    • Large pocket accumulations of uncured adhesive generate intense exothermic energy during cross-linking.
    • Avoid placing or leaving localized compound masses larger than 10 grams inside static configurations.
    • Ensure joint designs employ proper structural film tracking; thin paste layers within bond lines are completely safe.
    • Do not program thermal activation cycles exceeding the maximum recommended threshold of 350°F.
    Adhesion tracking breakdown or low lap shear force values over difficult plastics
    • While surface-tolerant on oily metals, unprimed structural bonds will not stick onto Teflon, PE, or PP.
    • Clear thick boundary layer greases or contaminants using industrial solvents; avoid acetone/IPA alone for heavy oils.
    • Introduce localized fine mechanical surface abrasion, chemical etching, plasma exposure, or specialized primers.
    • Screen rubber or plastic parts for high plasticizer loading; mobile plasticizers act as active bond release agents.
    Next Steps

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