LOCTITE EA 0151

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE EA0151

Main features

  • Clear, Two-Component Epoxy
  • Sixty-Minute Working Window
  • Room-Temperature Adhesive Cure

Product Description

LOCTITE® EA 0151 is a clear, two-component epoxy adhesive that provides optical clarity when used in small quantities. The thixotropic paste combines a 60-minute pot life at 77°F with room-temperature or heat-curing options, allowing time for mixing, dispensing and assembly. It bonds a range of materials, including glass, metals, circuit boards, fiber optics and many plastics. The mixed adhesive is clear and can be supplied through cartridges or prepared in bulk using the documented component ratio. Its 100% solids formulation and electrical properties make it relevant for bonding applications where appearance, controlled processing and dielectric performance are important.

Key features

  • Clear mixed appearance: Provides optical clarity when used in small quantities.
  • Flexible cure options: Reaches complete cure at room temperature or through documented accelerated heat-cure schedules.
  • 60-minute pot life: Provides a typical one-hour processing window at 77°F for a 100-gram mixed quantity.

Applications / Suitable for

  • Glass bonding
  • Metal bonding
  • Circuit board assembly
  • Fiber-optic bonding
  • Bonding many plastics

Technical Specifications

General Properties
Component SystemComponent System
Two-part
Mix RatioMix Ratio
100:33
Physical Properties
Viscosity (Part A)Viscosity (Part A)
40,000 to 100,000 mPa.s
Viscosity (Part B)Viscosity (Part B)
20,000 to 100,000 mPa.s
Mechanical Properties
ElongationElongation
2.4 %
Molded ShrinkageMolded Shrinkage
<0.3 %
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
57 °C
Thermal ConductivityThermal Conductivity
0.23 W/m.K
Electrical Properties
Dielectric StrengthDielectric Strength
42 kV/mm
Volume ResistivityVolume Resistivity
1.26E15 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties of the separate components and mixed adhesive.

Property Value Unit Method / condition
Color Milky white / Amber / Clear Part A / Part B / Mixed
Viscosity 40,000–100,000 cP Part A
Viscosity 20,000–100,000 cP Part B
Specific gravity 1.13 Part A
Specific gravity 0.98 Part B
Mix ratio by weight 100:33 Parts Part A:Part B
Mix ratio by volume 2.7:1 Parts Part A:Part B; mix cartridges dispense at 2:1
Pot life 60 min Mixed, 100 g at 77°F

After-processing / final-state properties

Typical properties of the cured adhesive, including reported NASA 1124 outgassing data.

Property Value Unit Method / condition
Elongation 2.4 % ASTM D638
Glass transition temperature 136 °F Typical cured value
Coefficient of thermal expansion 47 × 10-6 in/in/°C ASTM D696
Thermal conductivity 5.6 × 10-4 cal·cm/(cm²·s·°C) Typical cured value
Shrinkage <0.3 % Typical cured value
Hardness 85 Shore D Typical cured value
Dielectric strength 1080 V/mil ASTM D149
Volume resistivity 1.26 × 1015 ohm/cm ASTM D257
Total mass loss 1.51 % Outgassing performance, NASA 1124
Collected volatile condensable material 0.01 % Outgassing performance, NASA 1124

Leading Brands Trust in Our Products and Services

  • Jabil
  • Linxens
  • Magna
  • Medtronic
  • NXP
  • Philips
  • Semikron
  • Teledyne
  • Thales
  • Vishay
  • ZF
  • AMS
  • Apple
  • Audi
  • Broadcom
  • Borgwarner
  • Bosch
  • Eaton
  • Henkel
  • Honeywell
  • Hysol
  • Intel
Products that Perform|Knowledge that Serves|Service that Delivers