LOCTITE ECCOBOND EO 1061
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Extended Pot-Life Processing
- Stable-Viscosity Dispensing Control
- One-Part Heat-Cure Encapsulation
Product Description
LOCTITE® ECCOBOND EO1061 is a black, one-component, heat-cure epoxy encapsulant for chip-on-board assemblies and low-profile electronic devices. The medium-flow material contains 61.3 wt% filler and has typical viscosities of 50,000 mPa·s at 2 rpm and 32,500 mPa·s at 20 rpm at 25°C. Its viscosity stability at 25°C supports controlled shot sizing with conventional time/pressure dispensing equipment. A recommended cure of 3 hours at 140°C produces a cured glass transition temperature of 125°C. The product is designed for 1,000 hours of temperature/humidity/bias testing and thermal cycling up to 125°C. Because it is not thixotropic, a physical flow barrier is required during encapsulation.
Key features
- Stable dispensing viscosity: Viscosity stability at 25°C supports controlled shot sizing with conventional time/pressure equipment.
- Extended pot life: Typical pot life is 25 days at 25°C for a 200 g mass.
- High-temperature cured profile: The cured material has a typical Tg of 125°C and CTE below Tg of 40 ppm/°C from 40 to 120°C.
Applications / Suitable for
- Chip-on-board encapsulation
- Low-profile electronic devices
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
Typical uncured properties and processing parameters. Values are reference data and are not guaranteed product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Filler content | 61.3 | wt% | As supplied |
| Specific gravity | 1.78 | — | 25°C |
| Viscosity | 50,000 | mPa·s | Brookfield RVF, spindle 6, 2 rpm, 25°C |
| Viscosity | 32,500 | mPa·s | Brookfield RVF, spindle 6, 20 rpm, 25°C |
| Pot life | 25 | days | 25°C; 200 g mass |
| Gel time | 13 | min | 121°C |
| Recommended cure | 3 | h | 140°C; curing below 125°C is not recommended |
| Optimal storage temperature | −40 | °C | Unopened container in a dry location |
After-processing / final-state properties
Typical cured-material properties. Values are reference data and should not be treated as guaranteed design specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Coefficient of thermal expansion | 40 | ppm/°C | Below Tg; 40 to 120°C |
| Glass transition temperature | 125 | °C | Cured material |
| Linear shrinkage | 1.07 | % | Cured material |
| Flexural strength | 64.8 | N/mm² | Equivalent source value: 9,400 psi |
| Dielectric constant / dissipation factor | 4.97 / 0.0083 | — | IEC 60250; 25°C; 1 kHz |
| Volume resistivity | 1.9 × 1014 | Ω·cm | IEC 60093 |
| Surface resistivity | 2.0 × 1014 | Ω | IEC 60093 |
