LOCTITE SI 5920
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- One-Component Sealing System
- Non-Corrosive Sealing Formulation
- Thixotropic Application Control
Product Description
LOCTITE® SI 5920™ is a one-component, non-corrosive RTV silicone sealant designed for gasketing and sealing applications requiring excellent temperature resistance, flexibility, and electrical insulation properties. The thixotropic formulation minimizes migration after application and provides reliable sealing on a wide range of substrates. It is commonly used in industrial and electrical applications where long-term environmental resistance and high-temperature performance are required. Based on the uploaded datasheet image.
Key Features & Benefits
- One-component RTV silicone sealant.
- Non-corrosive curing system.
- Excellent temperature resistance up to 350°C service conditions.
- Thixotropic consistency minimizes migration after application.
- Adheres to a wide range of substrates.
- Provides electrical insulation properties.
- Suitable for gasketing and sealing applications.
- Excellent environmental durability.
Recommended Applications
- Industrial gasketing applications.
- General-purpose sealing.
- Electrical insulation applications.
- High-temperature sealing systems.
- Equipment maintenance and repair.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-Supplied / Before-Processing Properties
| Property | Value | Unit | Condition |
|---|---|---|---|
| Technology | Silicone | — | RTV sealant |
| Chemical Type | Silicone | — | Non-corrosive formulation |
| Appearance | Copper Colored Paste | — | Uncured material |
| Components | One Component | — | No mixing required |
| Consistency | Thixotropic | — | Reduced migration after application |
| Specific Gravity | 1.05 | — | 22°C |
| Extrusion Rate | ≥275 | g/min | 0.62 MPa, 22°C, 15 sec, Semco cartridge |
| Flow | ≤13 | mm | ISO 7390, after 2 minutes |
| Tack-Free Time | 20 - 60 | minutes | 25°C / 50±5% RH |
| Skin Over Time | 20 | minutes | Typical |
After-Processing / Final-State Properties
| Property | Value | Unit | Condition / Method |
|---|---|---|---|
| Depth of Cure | 10 | mm | Approximate depth after 7 days @ 22°C |
| Shore Hardness | 23 - 38 | Shore A | ISO 868, cured 7 days |
| Elongation at Break | ≥350 | % | ISO 37 |
| Tensile Strength | ≥1.4 | N/mm² | ISO 37 |
| Coefficient of Thermal Expansion | 340 × 10⁻⁶ | K⁻¹ | ISO 11359-2, cured 21 days |
| Volume Resistivity | 5.5 × 10¹⁵ | Ω·cm | IEC 60093 |
| Surface Resistivity | 200 × 10¹⁵ | Ω | IEC 60093 |
| Temperature Resistance | Up to 350 | °C | Typical application capability |
