LOCTITE TCF1000
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Pressure-Responsive Thermal Impedance
- Reworkable Residue-Free Removal
- Silicone-Free Phase-Change Interface
Product Description
LOCTITE TCF 1000 Phase-Change Thermal Interface Material combines a dry phase-change compound with an aluminum substrate for heat-sink and chassis interfaces. The compound softens at 60 deg C and flows under component mounting pressure to conform to surface features and reduce interface air. Two aluminum-backed constructions provide total thicknesses of 0.076 or 0.101 mm, with thermal impedance values specified at 20 and 100 psi. The silicone-free material is reworkable, can be removed without foreign residue, and is available as die-cut pads, sheets, or rolls for converters, power modules, IGBTs, RF components, and other non-isolated heat-generating devices.
Key features
- Pressure-Dependent Thermal Performance: Thermal impedance is specified for AL and ALH constructions at 20 and 100 psi.
- Reworkable Silicone-Free Construction: The dry interface can be removed without foreign residue after disassembly.
- Converted Pad and Roll Formats: Available as die-cut pads, sheets, or rolls for controlled interface placement.
Applications
Applications include DC-DC converters, solid-state relays, power transistors and modules, IGBTs, RF components, and non-isolated heat-generating devices mounted to heat sinks or chassis.
TDS, SDS & Technical Documents
Technical Specifications
Thermal Properties
General Properties
Additional Information
Supplied constructions
AL and ALH values identify two different aluminum-backed constructions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | White | As supplied | |
| Substrate | Aluminum | AL and ALH constructions | |
| AL compound thickness | 0.013 | mm per side | Nominal |
| AL total thickness | 0.076 | mm | Nominal construction |
| ALH compound thickness | 0.025 | mm per side | Nominal |
| ALH total thickness | 0.101 | mm | Nominal construction |
Installed interface properties
Thermal impedance depends on the selected construction and applied pressure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Phase-change temperature | 60 | deg C | Typical |
| Thermal impedance, AL | 0.194 | deg C cm^2/W | ASTM D5470, 20 psi |
| Thermal impedance, AL | 0.129 | deg C cm^2/W | ASTM D5470, 100 psi |
| Thermal impedance, ALH | 0.374 | deg C cm^2/W | ASTM D5470, 20 psi |
| Thermal impedance, ALH | 0.232 | deg C cm^2/W | ASTM D5470, 100 psi |
| Operating temperature | Up to 150 | deg C | Installed interface |
