PERMABOND ES558
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Solder-Like Heat-Activated Adhesive Flow
- 25 to 35 kJ/m^2 Impact Resistance
- One-Part No-Mix Heat Cure
Product Description
Permabond® ES558 is a high-performance, single-part epoxy paste that uniquely flows like solder when heated during the curing process. This free-flowing characteristic allows it to easily spread and cover the entire bond area. Formulated for maximum durability, this toughened adhesive delivers outstanding impact resistance, alongside excellent shear and peel strength, making it ideal for structurally bonding metals, ferrites, ceramics, and composites.
Key features
- Flows during cure: Uniquely designed to flow freely when heated, mimicking solder to ensure complete coverage of the bond area.
- Toughened for high strength: Provides exceptional impact strength (25-35 KJ/m²) and high shear strength for demanding applications.
- Single-part convenience: Requires no mixing and cures rapidly with heat (e.g., induction or oven), eliminating the risk of mixing errors and improving production efficiency.
Applications / Suitable for
- Bonding metals, ferrites, ceramics, and composites
- Assemblies where adhesive flow is desired during the heat-curing cycle
- Structural joints subject to high impact and vibration
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Thermal Properties
Other Properties
Additional Information
As-supplied / before-processing properties
Typical properties; these values are not intended for use in preparing specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Chemical Composition | Epoxy Resin | - | - |
| Appearance | Silver-grey | - | Paste |
| Viscosity | 100,000 to 300,000 | cP | at 25°C (mPa.s) |
| Specific Gravity | 1.5 | - | - |
| Maximum Gap Fill | 0.5 | mm | (0.02 in) |
| Flash Point | > 100 | °C | (212°F) |
After-processing / final-state properties
Typical properties; these values are not intended for use in preparing specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Flow at High Temperature | Free flow | - | - |
| Cure Speed | < 3 | minutes | Induction |
| Cure Speed | 75 | minutes | Oven at 130°C (266°F) |
| Cure Speed | 60 | minutes | Oven at 150°C (300°F) |
| Cure Speed | 40 | minutes | Oven at 170°C (338°F) |
| Shear Strength | 27-41 | N/mm² | Steel (ISO 4587) (4000-6000 psi) |
| Shear Strength | 17-31 | N/mm² | Aluminium (2500-4500 psi) |
| Shear Strength | > 14 | N/mm² | Steel to ferrite (>2000 psi) Substrate failure |
| Impact Strength | 25-35 | KJ/m² | ASTM D-950 |
| Hardness | 80-85 | Shore D | ISO 868 |
| E-modulus | 3.5 | GPa | - |
| Elongation at Break | < 3 | % | DIN 53504 |
| Coefficient of Thermal Expansion | 45E-6 | mm/mm/°C | (below Tg) |
| Coefficient of Thermal Expansion | 160E-6 | mm/m/°C | (above Tg) |
| Thermal Conductivity | 0.9 | W/(m.K) | - |
| Glass Transition Temperature (Tg) | 120 | °C | (250°F) DSC |
