TGP 1500 | Thermal Gap Pad

Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other

TGP1500 | Thermal Gap Pad

Main features

  • 0.94 Thermal Impedance
  • 1.5 Thermal Conductivity
  • 0.5 - 5 mm Thickness

Product Description

Honeywell's TGP1500 Thermal Gap Pads (TGP) are low cost materials, comparable to TGP1200 with better thermal performance and ease of use across a multitude of applications. Their ultra-high compressibility enables low stress and excellent conformity to mating surfaces. They are designed to minimize thermal resistance at interfaces, and maintain excellent performance through reliability testing. They have a very competitive cost of ownership and are ideal for not extremely demanding applications.

Honeywell's TGP1500 is naturally tacky, and requires no additional adhesive which could inhibit thermal performance. Products have very low hardness and are available in a thickness range from 0.5mm to 5.0mm.

 

Product Family

SOLSTICE TGP1500

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Product availability
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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Grey
Film ThicknessFilm Thickness
0.5 - 5 mm
Specific GravitySpecific Gravity
1.8
Thermal Properties
Thermal ConductivityThermal Conductivity
1.5 W/m.K
Thermal ImpedanceThermal Impedance
0.94 °C·cm²/W
UL 94 RatingUL 94 Rating
V-0
Electrical Properties
Volume ResistivityVolume Resistivity
20000000000000 Ohms⋅cm

Additional Information

 

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Thickness range:

  • 0.5-5.0mm with 0.25mm incremental

 

Thickness Tolerance: >1mm, ±10%

  • 0.5-1mm, ±0.1mm
  • <0.5mm, ±0.05mm

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