STYCAST 1090
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Low-Density Aerospace Encapsulation
- 45-Minute Working Window
- NASA Outgassing Performance
Product Description
LOCTITE STYCAST 1090 Epoxy Encapsulant is a two-component, black syntactic epoxy system for low-density encapsulation and potting. Used with CAT 9 catalyst at 100:9 by weight, the mixed material has a typical specific gravity of 0.79 and a 45-minute working time at 25 deg C. Multiple ambient and heat-cure schedules support production flexibility, while the cured material provides electrical insulation, compressive strength, and service from -40 to 130 deg C. Documented NASA outgassing results support evaluation for aerospace and other weight-sensitive electronic assemblies.
Key features
- Low-density syntactic formulation: A mixed specific gravity of 0.79 supports lightweight encapsulation.
- Controlled processing window: CAT 9 provides a typical 45-minute working time at 25 deg C.
- Documented outgassing data: Typical TML and CVCM values support aerospace material evaluation.
Applications
Applications include low-density encapsulation of aerospace, electronic, and electrical assemblies where weight, insulation, and compressive performance are important.
TDS, SDS & Technical Documents
Technical Specifications
No specifications available.
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Product form | Two-component black syntactic epoxy system | Resin with CAT 9 catalyst | |
| Mix ratio | 100:9 | parts by weight | Resin:CAT 9 |
| Mix ratio | 100:7 | parts by volume | Resin:CAT 9 |
| Resin viscosity | 135,000 | cP | 25 deg C; Brookfield, spindle 7, speed 10 |
| Mixed viscosity | 30,000 | cP | 25 deg C; typical |
| Mixed specific gravity | 0.79 | 25 deg C; typical | |
| Working time | 45 | minutes | 100 g mass at 25 deg C |
| Cure schedule | 16-24 h at 25 deg C; 4-6 h at 45 deg C; 1-2 h at 65 deg C | CAT 9 formulation |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating temperature | -40 to 130 | deg C | Cured material |
| Hardness | 80 | Shore D | Typical cured value |
| Thermal conductivity | 0.19 | W/(m K) | Typical cured value |
| Water absorption | 0.55 | % | 24 hours |
| Compressive strength | 12,000 | psi | Typical cured value |
| Volume resistivity | >1 x 10^13 | ohm cm | 25 deg C |
| Total mass loss | 0.46 | % | NASA outgassing test |
| Collected volatile condensable material | 0.06 | % | NASA outgassing test |
