STYCAST 2651-1
Harmonization Code : 3214.10.00 | Putty and other mastics | Resin cements, caulking compounds and other mastics
Main features
- One-Component Production Handling
- -40 to 155 deg C Service
- Thermal-Shock-Resistant Electronic Encapsulation
Product Description
LOCTITE STYCAST 2651-1 One-Component Epoxy Encapsulant is a black, one-component medium-viscosity filled epoxy for heat-cured encapsulation of small electrical and electronic assemblies. The ready-to-use material has a typical viscosity of 52,000 cP and avoids component mixing, supporting controlled production handling. Cure options range from eight hours at 80 deg C to four hours at 120 deg C, followed by a recommended post-cure for final property development. The cured encapsulant provides electrical insulation, 0.58 W/(m K) thermal conductivity, thermal-shock resistance, and an operating range of -40 to 155 deg C.
Key features
- One-component handling: The ready-to-use formulation removes mix-ratio and catalyst-selection steps.
- Heat-cure flexibility: Multiple cure schedules from 80 to 120 deg C support production planning.
- Wide operating range: The cured system is documented for service from -40 to 155 deg C.
Applications
Applications include heat-cured encapsulation of small electrical and electronic assemblies requiring insulation, thermal-shock resistance, and a one-component process.
TDS, SDS & Technical Documents
Technical Specifications
No specifications available.
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Product form | One-component black filled epoxy | Ready to use | |
| Viscosity | 52,000 | cP | 25 deg C; Brookfield, spindle 7, 20 rpm |
| Specific gravity | 1.6 | Typical as supplied | |
| Shelf life | 90 | days | 25 deg C |
| Cure schedule | 8 h at 80 deg C; 6 h at 100 deg C; 4 h at 120 deg C | Typical options | |
| Post-cure | 2-4 | hours | 150 deg C |
| Process mass guidance | Approximately 50 | g | No adverse exotherm observed at 120 deg C up to this mass |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating temperature | -40 to 155 | deg C | Cured material |
| Hardness | 88 | Shore D | Typical cured value |
| Coefficient of thermal expansion | 45 x 10^-6 | per deg C | Typical cured value |
| Linear shrinkage | 0.002 | cm/cm | Typical cured value |
| Water absorption | 0.1 | % | 24-hour boil |
| Thermal conductivity | 0.58 | W/(m K) | Typical cured value |
| Dielectric strength | 17.3 | kV/mm | Typical cured value |
| Volume resistivity | 1 x 10^15 | ohm cm | 25 deg C |
