STYCAST 2651-40
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
Product Description
LOCTITE STYCAST 2651-40 CAT 11 is a two-component, heat-curing epoxy encapsulant designed for general-purpose electronic encapsulation applications. This low-viscosity formulation offers excellent adhesion to a wide range of substrates while providing dielectric performance, chemical resistance, and mechanical strength after cure. With a working life exceeding four hours at room temperature and operating temperatures from -55°C to +155°C, it is suitable for encapsulating electronic assemblies, coils, and components that require environmental protection and electrical insulation. The material delivers stable physical and electrical properties in demanding operating environments.
Key features
- Low viscosity formulation: Mixed viscosity of approximately 4,000 cP supports flow into complex cavities and densely packed assemblies.
- Dielectric performance: Provides electrical insulation with dielectric strength of 450 volts/mil after cure.
- Wide temperature capability: Operates across temperatures from -55°C to +155°C for demanding electronic applications.
Applications / Suitable for
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Properties representative of the uncured resin, catalyst, and mixed system prior to heat cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix Ratio | 100 : 10.5 | Weight Ratio | Resin : Catalyst |
| Mixed Viscosity | 4,000 | cP | Brookfield |
| Mixed Density | 1.45 | g/cm³ | Mixed material |
| Working Life | >4 | hours | 100 g mass at 25°C |
| Shelf Life | 6 | months | Resin at 25°C |
After-processing / final-state properties
Representative cured properties following recommended heat cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Shore Hardness | 88 | Shore D | Cured material |
| Thermal Conductivity | 0.55 | W/m·K | Cured material |
| Tensile Strength | 63 | MPa | Cured material |
| Compressive Strength | 107 | MPa | Cured material |
| Dielectric Strength | 450 | volts/mil | Electrical property |
| Volume Resistivity | >1×10¹⁴ | ohm-cm | 25°C |
