Techsil TIM11150 (GB)
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 2.30 W/(m K) Thermal Conductivity
- Embedded 50 um Glass Beads
- Non-Corrosive Bonding Formulation
Product Description
Techsil® TIM11150 (GB) is a one-part, solvent-free acetone-cure RTV silicone sealant containing 50 µm glass beads for controlled self-gapping applications. The grey paste cures through atmospheric moisture to form a tough elastomer and is non-corrosive to copper and copper alloys. It combines fast skin formation with a typical cured thermal conductivity of 2.30 W/m·K and documented electrical insulation properties.
Key features
- Thermally conductive cured elastomer: Provides a typical thermal conductivity of 2.30 W/m·K after seven days of cure at 23 ± 2 °C and 65% relative humidity.
- Controlled self-gapping: Contains 50 µm glass beads to maintain separation in supported self-gapping applications.
- Non-corrosive moisture cure: The one-part, solvent-free acetone-cure system does not corrode copper or copper alloys and reaches tack-free condition in four minutes under stated conditions.
Applications / Suitable for
- Self-gapping applications requiring 50 µm glass-bead spacing
- Sealing and adhesive applications where a one-part RTV silicone is suitable
- Applications involving copper or copper-alloy surfaces where non-corrosive cure is required
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical uncured and processing properties of Techsil® TIM11150 (GB). Typical technical data are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Chemistry and cure type | One-part, acetone-cure RTV silicone | — | Moisture cure; solvent free |
| Color and appearance | Grey paste | — | As supplied |
| Glass-bead particle size | 50 | µm | For self-gapping applications |
| Viscosity | 350,000 | mPa·s | Brookfield |
| Tack-free time | 4 | minutes | Measured at 23 ± 2 °C and 65% relative humidity |
| Cure-through time | <8 | hours | 3 mm section at 23 ± 2 °C and 65% relative humidity |
| Full cure | 7 | days | Supplier-stated full-cure time |
| Shelf life | 12 | months | Expected in original unopened containers stored below 40 °C |
After-processing / final-state properties
Typical cured properties of Techsil® TIM11150 (GB) after seven days at 23 ± 2 °C and 65% relative humidity, except where otherwise stated. Typical technical data are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Tensile strength | 3.90 | MPa | BS 903 Part A2 |
| Elongation at break | 103 | % | BS 903 Part A2 |
| Hardness | 67 | Shore A | ASTM D2240-95 |
| Specific gravity | 2.11 | — | BS 903 Part A1 |
| Linear shrinkage | 0.5 | % | Test method not stated |
| Thermal conductivity | 2.30 | W/m·K | Test method not stated |
| Service temperature | -50 to 220 | °C | Minimum stated without method; maximum per AFS 1540B |
| Volume resistivity | 1 × 1014 | Ω·cm | ASTM D257 |
| Dielectric strength | 20 | kV/mm | ASTM D149 |
